Wang, Hsin-Wei
16253  Ergebnisse:
Personensuche X
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1

An Effective Mixture-Of-Experts Approach For Code-Switching..:

, In: ICASSP 2024 - 2024 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP),
Yang, Tzu-Ting ; Wang, Hsin-Wei ; Wang, Yi-Cheng.. - p. 11226-11230 , 2024
 
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2

Effective Graph-Based Modeling of Articulation Traits for M..:

, In: ICASSP 2023 - 2023 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP),
 
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4

AVATAR: Robust Voice Search Engine Leveraging Autoregressiv..:

, In: 2023 Asia Pacific Signal and Information Processing Association Annual Summit and Conference (APSIPA ASC),
Wang, Yi-Cheng ; Yang, Tzu-Ting ; Wang, Hsin-Wei.. - p. 2331-2335 , 2023
 
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6

Preserving Phonemic Distinctions For Ordinal Regression: A ..:

, In: 2023 IEEE Automatic Speech Recognition and Understanding Workshop (ASRU),
 
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7

Peppanet: Effective Mispronunciation Detection and Diagnosi..:

, In: 2022 IEEE Spoken Language Technology Workshop (SLT),
Yan, Bi-Cheng ; Wang, Hsin-Wei ; Chen, Berlin - p. 1045-1051 , 2023
 
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8

Effective Cross-Utterance Language Modeling for Conversatio..:

, In: 2022 International Joint Conference on Neural Networks (IJCNN),
 
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9

Maximum F1-Score Training for End-to-End Mispronunciation D..:

, In: 2022 IEEE International Conference on Multimedia and Expo (ICME),
 
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10

Exploring Non-Autoregressive End-to-End Neural Modeling for..:

, In: ICASSP 2022 - 2022 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP),
Wang, Hsin-Wei ; Yan, Bi-Cheng ; Chiu, Hsuan-Sheng.. - p. 6817-6821 , 2022
 
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11

Effective ASR Error Correction Leveraging Phonetic, Semanti..:

, In: 2022 Asia-Pacific Signal and Information Processing Association Annual Summit and Conference (APSIPA ASC),
Wang, Hsin-Wei ; Yan, Bi-Cheng ; Wang, Yi-Cheng. - p. 117-122 , 2022
 
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12

Experimental Measurements for Equilibrium Conditions of Car..:

Tang, Muoi ; Wang, Hsin-Wei ; Wu, Yi-Ping..
Journal of Chemical & Engineering Data.  67 (2022)  10 - p. 2954-2962 , 2022
 
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15

A Novel Design of Temporary Bond Debond Adhesive Technology..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
 
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