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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
1
Room Temperature Bonding of CVD Polycrystalline Diamond Waf..:
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2024 International Conference on Electronics Packaging (ICEP) ,
2
Cathodoluminescence Characterization of Diamond Polished by..:
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2023 International Conference on Electronics Packaging (ICEP) ,
3
Protection of Activated Au Surface using Self-assembled Mon..:
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2023 International Conference on Electronics Packaging (ICEP) ,
5
Compensation of the Warpage of CVD Diamond Wafers using Int..:
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2023 IEEE CPMT Symposium Japan (ICSJ) ,
7
Polishing of CVD Diamond for Direct Bonding Using Ar and SF..:
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2022 International Conference on Electronics Packaging (ICEP) ,
8
Polishing Diamond Substrates using Gas Cluster Ion Beam (GC..:
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2022 IEEE CPMT Symposium Japan (ICSJ) ,
10