Wang, Miaocao
19  Ergebnisse:
Personensuche X
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1

Investigation of vibration-assisted nano-grinding of galliu..:

Huang, Yuhua ; Wang, Miaocao ; Xu, Yixin.
Materials Science in Semiconductor Processing.  121 (2021)  - p. 105372 , 2021
 
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2

Removal behavior of micropipe in 4H-SiC during micromachini..:

Huang, Yuhua ; Wang, Miaocao ; Li, Jinming.
Journal of Manufacturing Processes.  68 (2021)  - p. 888-897 , 2021
 
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3

Effect of abrasive particle shape on the development of sil..:

Huang, Yuhua ; Wang, Miaocao ; Li, Jinming.
Computational Materials Science.  193 (2021)  - p. 110420 , 2021
 
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4

Effect of inclusion on 4H-SiC during nano-scratching from a..:

Huang, Yuhua ; Wang, Miaocao ; Li, Jinming.
Journal of Physics: Condensed Matter.  33 (2021)  43 - p. 435402 , 2021
 
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7

Crack initiation and propagation mechanism of Al2O3-DBC sub..:

Xu, Ling ; Liu, Sheng ; Wang, Miaocao.
Engineering Failure Analysis.  116 (2020)  - p. 104720 , 2020
 
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8

Investigation on gallium nitride with N-vacancy defect nano..:

Huang, Yuhua ; Wang, Miaocao ; Xu, Yixin.
Journal of Manufacturing Processes.  57 (2020)  - p. 153-162 , 2020
 
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9

Investigation on the Interface Thermal Resistance of Copper..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Xu, Yixin ; Zhu, Fulong ; Wang, Miaocao... - p. 1-4 , 2019
 
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10

Study on subsurface damage of wafer silicon containing thro..:

Xu, Yixin ; Wang, Miaocao ; Zhu, Fulong...
The European Physical Journal Plus.  134 (2019)  5 - p. , 2019
 
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13

An optimal structural design to improve the reliability of ..:

Xu, Ling ; Wang, Miaocao ; Zhou, Yang..
Microelectronics Reliability.  56 (2016)  - p. 101-108 , 2016
 
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