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Wee, David Ho Soon
80  Ergebnisse:
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1

3D Stacking of Heterogeneous Chiplets on Modified FOWLP Pla..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chong, Chai Tai ; Long, Lau Boon ; Siang, Sharon Lim Pei... - p. 24-28 , 2023
Link: https://doi.org/10.1109/..
 
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2

Development of PMUT Array Packaging from Characterisation P..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Giusti, Dominico ; Gritti, Alex ; Quaglia, Fabio... - p. 1442-1449 , 2023
Link: https://doi.org/10.1109/..
 
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3

Co-packaging of PMUT array with FOWLP ASIC's:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Giusti, Domenico ; Quaglia, Fabio ; Rahul, Dutta... - p. 280-285 , 2022
Link: https://doi.org/10.1109/..
 
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4

NetFlex: A 22nm Multi-Chiplet Perception Accelerator in Hig..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Chou, Teyuh ; Tang, Wei ; Rotaru, Mihai D.... - p. 208-209 , 2022
Link: https://doi.org/10.1109/..
 
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5

Assembly challenges and demonstrations of ultra-large Anten..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lim, Sharon Pei Siang ; Chong, Ser Choong ; Wee, David Ho Soon. - p. 635-642 , 2022
Link: https://doi.org/10.1109/..
 
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6

Fine-Pitch RDL Integration for Fan-Out Wafer-Level Packagin:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Lianto, Prayudi ; Tan, Chin Wei ; Jie Peng, Qi... - p. 1126-1131 , 2020
Link: https://doi.org/10.1109/..
 
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7

Effect of laser on passivation photo-dielectric during lase..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Hsiang-Yao, Hsiao ; Wee, David Ho Soon - p. 671-675 , 2019
Link: https://doi.org/10.1109/..
 
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8

Magnetic Inductor Integration in FO-WLP using RDL-first App..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Boon, Soh Siew ; Wee, David Ho Soon ; Salahuddin, Raju. - p. 18-22 , 2019
Link: https://doi.org/10.1109/..
 
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9

A Heterogeneously Integrated Wafer-level Processed Co-Packa..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Nair Gourikutty, Sajay Bhuvanendran ; Long, Lau Boon ; Wei, Seit Wen... - p. 207-211 , 2023
Link: https://doi.org/10.1109/..
 
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10

Laser drilling and Plasma Cleaning Process for Blind Via Th..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Hsiao, Hsiang-Yao ; Wee Ho, David Soon ; Sing Lim, Keith Cheng... - p. 14-18 , 2020
Link: https://doi.org/10.1109/..
 
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11

A Compact Wafer-Level Heterogeneously Integrated Scalable O..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Nair Gourikutty, Sajay Bhuvanendran ; Wu, Jiaqi ; Lim, Teck Guan... - p. 1398-1403 , 2024
Link: https://doi.org/10.1109/..
 
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12

77-GHz FOWLP MIMO AiP for Compact High-Resolution Radar Wit..:

Sun, Mei ; Guan Lim, Teck ; Soon Wee Ho, David...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  4 - p. 537-546 , 2024
Link: https://doi.org/10.1109/..
 
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13

Through Mold Vertical Interconnect Formation in FOWLP using..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Siew Boon, Serine Soh ; David Ho, Soon Wee ; Jaafar, Norhanani - p. 125-128 , 2023
Link: https://doi.org/10.1109/..
 
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14

A Novel Packaging Platform for High-Performance Optical Eng..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Gourikutty, Sajay Bhuvanendran Nair ; Jong, Ming Chinq ; Kanna, Chockanathan Vinoth... - p. 422-427 , 2022
Link: https://doi.org/10.1109/..
 
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15

Process Development of Fan-Out with Multi-layer RDL for Chi..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Hsiang-Yao, Hsiao ; Soon Wee, David Ho ; PS, Sharon Lim - p. 89-93 , 2022
Link: https://doi.org/10.1109/..
 
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