Wei, Pal Jen
8985  Ergebnisse:
Personensuche X
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1

Compensating for Creep Effects in One-Indent Nanoindentatio..:

Huu Hung, Nguyen ; Wei, Pal Jen ; Lin, Jen Fin
Applied Mechanics and Materials.  764-765 (2015)  - p. 28-31 , 2015
 
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4

Electric contact resistance for monitoring nanoindentation-..:

Nguyen, Huu Hung ; Wei, Pal Jen ; Lin, Jen Fin
Advances in Natural Sciences: Nanoscience and Nanotechnology.  2 (2011)  1 - p. 015007 , 2011
 
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5

A Model Developed for the Adhesion Forces Formed between an..:

Chen, Sheng Chao ; Wei, Pal Jen ; Lin, Jen Fin
Japanese Journal of Applied Physics.  48 (2009)  5R - p. 055001 , 2009
 
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8

Modified method for continuous stiffness measurement:

Wei, Pal Jen ; Lin, Jen Fin
Journal of Materials Research.  24 (2009)  3 - p. 599-606 , 2009
 
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9

Modified method developed for contact-induced adhesion in i..:

Shen, Yan Xing ; Wei, Pal Jen ; Lin, Jen Fin
Journal of Materials Research.  24 (2009)  5 - p. 1795-1802 , 2009
 
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10

The reflectivity of an etched silicon surface with pyramids..:

Wu, Chen Jian ; Wei, Pal Jen ; Lin, Jen Fin
Journal of Micromechanics and Microengineering.  19 (2009)  11 - p. 115015 , 2009
 
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12

Determination for elasticity and plasticity from time-depen..:

Wei, Pal Jen ; Lin, Jen Fin
Materials Science and Engineering: A.  496 (2008)  1-2 - p. 90-97 , 2008
 
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