Ich stimme zu, dass diese Seite Cookies verwende. Weitere Informationen finden Sie unter unseren Datenschutzerklärungen .
X
Wei, Seit Wen
188  Ergebnisse:
Personensuche X
?
1

A Heterogeneously Integrated Wafer-level Processed Co-Packa..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Nair Gourikutty, Sajay Bhuvanendran ; Long, Lau Boon ; Wei, Seit Wen... - p. 207-211 , 2023
Link: https://doi.org/10.1109/..
 
?
2

A Novel Packaging Platform for High-Performance Optical Eng..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Gourikutty, Sajay Bhuvanendran Nair ; Jong, Ming Chinq ; Kanna, Chockanathan Vinoth... - p. 422-427 , 2022
Link: https://doi.org/10.1109/..
 
?
3

Development of Nitride-Based Optical Phased Array at 1092 n..:

Lim, Yu Dian ; Goh Chun Kiat, Simon ; Seit, Wen Wei...
IEEE Photonics Technology Letters.  35 (2023)  16 - p. 855-857 , 2023
Link: https://doi.org/10.1109/..
 
?
4

Simplified Assembly of Through-Silicon-Via Integrated Ion T..:

Zhao, Peng ; Li, Hong Yu ; Likforman, Jean-Pierre...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  9 - p. 1337-1343 , 2023
Link: https://doi.org/10.1109/..
 
?
5

The Integration of Grounding Plane into TSV Integrated Ion ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Zhao, Peng ; Li, Hong Yu ; Dian Lim, Yu... - p. 137-142 , 2022
Link: https://doi.org/10.1109/..
 
?
6

Comprehensive Study on Die Shift with Ultra-Large Embedded ..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Seit, Wen Wei ; Chong, Ser Choong ; Lim, Sharon. - p. 150-155 , 2022
Link: https://doi.org/10.1109/..
 
?
7

Ceramic Pin Grid Array with Built-in Interconnects to Locat..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Zhao, Peng ; Li, Hong Yu ; Lim, Yu Dian... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
?
8

Comprehensive study on effect of chip layout and mold thick..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Lim, Sharon Pei Siang ; Chong, Ser Choong ; Seit, Wen Wei... - p. 945-950 , 2022
Link: https://doi.org/10.1109/..
 
?
9

Large‐Scale Fabrication of Surface Ion Traps on a 300 mm Gl..:

Tao, Jing ; Likforman, Jean-Pierre ; Zhao, Peng...
physica status solidi (b).  258 (2021)  7 - p. 2000589 , 2021
Link: https://doi.org/10.1002/..
 
?
10

Glass Substrate Interposer for TSV-integrated Surface Elect..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Zhao, Peng ; Li, Hong Yu ; Lim, Yu Dian... - p. 262-265 , 2020
Link: https://doi.org/10.1109/..
 
?
11

Surface Electrode Ion Trap Developed and Improvement by Oxi..:

, In: 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Li, H.Y. ; Seit, Wen Wei ; Gilho, Hwang... - p. 1-5 , 2020
Link: https://doi.org/10.1109/..
 
?
12

Simplified Assembly of Through-Silicon-Via Integrated Ion T..:

Zhao, Peng ; Li, Hong Yu ; Likforman, Jean-Pierre...
info:eu-repo/semantics/altIdentifier/doi/10.1109/TCPMT.2023.3309831.  , 2023
Link: https://hal.science/hal-..
 
?
13

Simplified Assembly of Through-Silicon-Via Integrated Ion T..:

Zhao, Peng ; Li, Hong Yu ; Likforman, Jean-Pierre...
info:eu-repo/semantics/altIdentifier/doi/10.1109/TCPMT.2023.3309831.  , 2023
Link: https://hal.science/hal-..
 
?
14

RF performance benchmarking of TSV integrated surface elect..:

Zhao, Peng ; Li, Hong Yu ; Tao, Jing...
info:eu-repo/semantics/altIdentifier/doi/10.1109/TCPMT.2021.3114172.  , 2021
Link: https://hal.science/hal-..
 
?
15

RF performance benchmarking of TSV integrated surface elect..:

Zhao, Peng ; Li, Hong Yu ; Tao, Jing...
info:eu-repo/semantics/altIdentifier/doi/10.1109/TCPMT.2021.3114172.  , 2021
Link: https://hal.science/hal-..
 
1-15