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Wei-Ping Dow
117  Ergebnisse:
Personensuche X
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1

Novel Cu plating formula for filling through silicon vias:

, In: 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference,
Shao-Ping Shen ; Wei-Ping Dow ; Motonobu Kubo... - p. None , 2009
Link: https://doi.org/10.1109/..
 
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2

Effect of Copper Grain Size on the Interfacial Microstructu..:

Chan, Po-Fan ; Lee, Hsuan ; Wen, Shih-I...
ACS Applied Electronic Materials.  2 (2020)  2 - p. 464-472 , 2020
Link: https://doi.org/10.1021/..
 
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3

Polyimide Metallization Using Nickel Nano-Film as both Cata..:

Huang, Shang-En ; Shen, Fang-Yu ; Dow, Wei-Ping
Journal of The Electrochemical Society.  166 (2019)  15 - p. D843-D850 , 2019
Link: https://doi.org/10.1149/..
 
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4

Influence of additives on electroplated copper films and th..:

Lee, Hsuan ; Tsai, Shan-Ting ; Wu, Ping-Heng..
Materials Characterization.  147 (2019)  - p. 57-63 , 2019
Link: https://doi.org/10.1016/..
 
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5

Spontaneous Potential Oscillation Resulting in Copper Depos..:

Chan, Po-Fan ; Dow, Wei-Ping
Journal of The Electrochemical Society.  166 (2019)  16 - p. D891-D897 , 2019
Link: https://doi.org/10.1149/..
 
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6

Electroplated Cu Bump with Ultra-Large Grain without Therma..:

, In: 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D),
Dow, Wei-Ping ; Chan, Po-Fan - p. 36-36 , 2019
Link: https://doi.org/10.23919..
 
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7

Contrasts in Copper Deposition on Pt(111) Modified by 1-Mer..:

Yau, Shuehlin ; Huang, Yutang ; Dow, Wei-Ping.
Journal of The Electrochemical Society.  165 (2018)  14 - p. D761-D767 , 2018
Link: https://doi.org/10.1149/..
 
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8

Direct Copper Pattern Plating on Glass and Ceramic Substrat..:

Cheng, Chia-Wen ; Chan, Po-Fan ; Dow, Wei-Ping
Journal of The Electrochemical Society.  164 (2017)  12 - p. D687-D693 , 2017
Link: https://doi.org/10.1149/..
 
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9

Impurity Incorporation in the Cu Electrodeposit and Its Eff..:

Lee, Hsuan ; Yu, Tai-Yi ; Cheng, Hsi-Kuei...
Journal of The Electrochemical Society.  164 (2017)  7 - p. D457-D462 , 2017
Link: https://doi.org/10.1149/..
 
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10

Effects of Additives and Convection on Cu Foil Fabrication ..:

Chan, Po-Fan ; Ren, Rung-Hsuan ; Wen, Shih-I..
Journal of The Electrochemical Society.  164 (2017)  9 - p. D660-D665 , 2017
Link: https://doi.org/10.1149/..
 
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11

Interactive Effects of Additives and Electrolyte Flow Rate ..:

Lin, Chun-Cheng ; Yen, Chih-Han ; Lin, Sheng-Chi..
Journal of The Electrochemical Society.  164 (2017)  13 - p. D810-D817 , 2017
Link: https://doi.org/10.1149/..
 
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12

Effects of Cu Electroplating Formulas on the Interfacial Mi..:

Yu, Tai-Yi ; Lee, Hsuan ; Hsu, Hsuan-Ling...
Journal of The Electrochemical Society.  163 (2016)  13 - p. D734-D741 , 2016
Link: https://doi.org/10.1149/..
 
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13

In situ STM imaging of polyethylene glycol adsorbed on an A..:

Li, Lai-Han ; Yau, Shuehlin ; Dow, Wei-Ping
Electrochemistry Communications.  70 (2016)  - p. 1-4 , 2016
Link: https://doi.org/10.1016/..
 
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14

Effects of Brighteners in a Copper Plating Bath on Throwing..:

Chen, Tzu-Chi ; Tsai, Yao-Lin ; Hsu, Chia-Fu..
Electrochimica Acta.  212 (2016)  - p. 572-582 , 2016
Link: https://doi.org/10.1016/..
 
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15

Electrodeposition of copper on an Au(111) electrode modifie..:

Lai, Chao-Shan ; Hu, Xiao-Xuan ; Yau, Shuehlin..
Electrochimica Acta.  203 (2016)  - p. 272-280 , 2016
Link: https://doi.org/10.1016/..
 
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