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Weikok, Tee
5  Ergebnisse:
Personensuche X
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1

Comprehensive Comparison of the Wire Bond Reliability Perfo..:

, In: 2020 China Semiconductor Technology International Conference (CSTIC),
Lois, Liao Jinzhi ; Minglang, Yu ; Weikok, Tee... - p. 1-5 , 2020
Link: https://doi.org/10.1109/..
 
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2

bHAST, PCT, TCT reliability performance comparison of Cu-Al..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Lois, Liao Jinzhi ; Weikok, Tee ; Minglang, Yu... - p. 63-67 , 2020
Link: https://doi.org/10.1109/..
 
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3

Enhancing High Temperature Adhesion Performance Via a Renov..:

, In: 2020 China Semiconductor Technology International Conference (CSTIC),
Neoh, Din-Ghee ; Weikok, Tee ; Lois, Liao Jinzhi... - p. 1-8 , 2020
Link: https://doi.org/10.1109/..
 
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4

Comprehensive study of wire bond reliability impacts from w..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Lois, Liao Jinzhi ; Songlin, Mao ; Bisheng, Wang... - p. 197-202 , 2019
Link: https://doi.org/10.1109/..
 
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5

Comparison of Cl effect on Au-Al and Cu-Al HTS and bHAST wi..:

, In: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA),
Bisheng, Wang ; Jinzhi, Lois Liao ; Xi, Zhang... - p. 1-6 , 2019
Link: https://doi.org/10.1109/..
 
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