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Werum, Kai
21  Ergebnisse:
Personensuche X
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1

Dielectric Properties of PEEK/PEI Blends as Substrate Mater..:

Scherzer, Tim ; Wolf, Marius ; Werum, Kai...
Micromachines.  15 (2024)  6 - p. 801 , 2024
Link: https://doi.org/10.3390/..
 
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2

Analysis of Tempering Effects on LDS-MID and PCB Substrates..:

Wolf, Marius ; Werum, Kai ; Guenther, Thomas...
Journal of Manufacturing and Materials Processing.  7 (2023)  4 - p. 139 , 2023
Link: https://doi.org/10.3390/..
 
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3

Injection Compression Molding of LDS-MID for Millimeter Wav..:

Wolf, Marius ; Werum, Kai ; Eberhardt, Wolfgang..
Journal of Manufacturing and Materials Processing.  7 (2023)  5 - p. 184 , 2023
Link: https://doi.org/10.3390/..
 
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4

Characterization of Wire-Bonding on LDS Materials and HF-PC..:

Guenther, Thomas ; Werum, Kai ; Müller, Ernst..
Journal of Manufacturing and Materials Processing.  6 (2022)  1 - p. 9 , 2022
Link: https://doi.org/10.3390/..
 
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5

Aerosol Jet Printing and Interconnection Technologies on Ad..:

Werum, Kai ; Mueller, Ernst ; Keck, Juergen...
Journal of Manufacturing and Materials Processing.  6 (2022)  5 - p. 119 , 2022
Link: https://doi.org/10.3390/..
 
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6

Contacting Inkjet-Printed Silver Structures and SMD by ICA ..:

Jager, Jonas ; Buschkamp, Sascha ; Werum, Kai...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  12 (2022)  7 - p. 1232-1240 , 2022
Link: https://doi.org/10.1109/..
 
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7

Characterization of a PCB Based Pressure Sensor and Its Joi..:

Schwenck, Adrian ; Grözinger, Tobias ; Günther, Thomas...
Sensors.  21 (2021)  16 - p. 5557 , 2021
Link: https://doi.org/10.3390/..
 
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8

Analysis of tempering effects on LDS-MID and PCB substrates..:

Wolf, Marius ; Werum, Kai ; Guenther, Thomas...
doi:10.3390/jmmp7040139.  , 2023
Link: https://doi.org/10.18419..
 
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9

Injection compression molding of LDS-MID for millimeter wav..:

Wolf, Marius ; Werum, Kai ; Eberhardt, Wolfgang..
doi:10.3390/jmmp7050184.  , 2023
Link: https://doi.org/10.18419..
 
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10

Characterization of wire-bonding on LDS materials and HF-PC..:

Guenther, Thomas ; Werum, Kai ; Müller, Ernst..
doi:10.3390/jmmp6010009.  , 2022
Link: https://doi.org/10.18419..
 
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11

Characterization of a PCB based pressure sensor and its joi..:

Schwenck, Adrian ; Grözinger, Tobias ; Guenther, Thomas...
doi:10.3390/s21165557.  , 2021
Link: https://doi.org/10.18419..
 
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12

Characterization of a PCB Based Pressure Sensor and Its Joi..:

Schwenck, Adrian ; Grözinger, Tobias ; Günther, Thomas...
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC8402279/.  , 2021
Link: http://www.ncbi.nlm.nih...
 
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13

Analysis of Tempering Effects on LDS-MID and PCB Substrates..:

Marius Wolf ; Kai Werum ; Thomas Guenther...
https://dx.doi.org/10.3390/jmmp7040139.  , 2023
Link: https://doi.org/10.3390/..
 
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14

Analysis of Tempering Effects on LDS-MID and PCB Substrates..:

Marius Wolf ; Kai Werum ; Thomas Guenther...
https://www.mdpi.com/2504-4494/7/4/139.  , 2023
Link: https://doi.org/10.3390/..
 
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15

Injection Compression Molding of LDS-MID for Millimeter Wav..:

Marius Wolf ; Kai Werum ; Wolfgang Eberhardt..
https://www.mdpi.com/2504-4494/7/5/184.  , 2023
Link: https://doi.org/10.3390/..
 
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