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2024 18th European Conference on Antennas and Propagation (EuCAP) ,
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Sub-THz Substrate Integrated Waveguide Signal Transitions i..:
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2020 IEEE 20th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) ,
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Thermo-Mechanical Modeling and Experimental Validation of a..:
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2020 IEEE 20th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) ,
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Full-wave RF Modeling of a Fan-Out Wafer-Level Packaging Te..:
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2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ,
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Development of a Through-Silicon Via (TSV) Process Module f..:
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2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ,
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Development of a Multi-project Fan-Out Wafer Level Packagin..:
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2012 IEEE 12th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems ,
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