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Wietstruck, Matthias
74  Ergebnisse:
Personensuche X
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1

The Chip-Level in-Plane Stress Distribution over BiCMOS Waf..:

, In: 2024 IEEE 24th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF),
Cao, Zhibo ; Voss, Thomas ; Wietstruck, Matthias.. - p. 45-47 , 2024
Link: https://doi.org/10.1109/..
 
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2

A Collective Die to Wafer Bonding Approach Based on Surface..:

Schulze, Sebastian ; Voß, Thomas ; Krüger, Patrick.
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  3 - p. 519-524 , 2024
Link: https://doi.org/10.1109/..
 
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3

The Assembly Investigation of a Multi-chip to PCB Flip-chip..:

Cao, Zhibo ; Lehmann, Jens ; Heusdens, Bruno...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  , 2024
Link: https://doi.org/10.1109/..
 
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4

Design of a 240 GHz Dielectric Resonator Antennain 130nm Si..:

, In: 2024 15th German Microwave Conference (GeMiC),
Bashir, Muhammad Faisal ; Wietstruck, Matthias - p. 73-76 , 2024
Link: https://doi.org/10.23919..
 
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5

Design and Investigation of 2x2 Dielectric Resonator Antenn..:

, In: 2024 18th European Conference on Antennas and Propagation (EuCAP),
Bashir, Muhammad Faisal ; Wietstruck, Matthias - p. 1-4 , 2024
Link: https://doi.org/10.23919..
 
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6

SiGe BiCMOS Technology with Embedded Microchannels based on..:

, In: 2023 IEEE International 3D Systems Integration Conference (3DIC),
Can Durmaz, Emre ; Heine, Carl ; Cao, Zhibo... - p. 01-04 , 2023
Link: https://doi.org/10.1109/..
 
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7

D-Band Flip-Chip Packaging with Wafer-Level Cu-pillar Bumps:

, In: 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Cao, Zhibo ; Stocchi, Matteo ; Wipf, Christian... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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8

Characterization and Optimization of the Heat Dissipation C..:

Cao, Zhibo ; Stocchi, Matteo ; Wietstruck, Matthias...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  3 - p. 346-355 , 2023
Link: https://doi.org/10.1109/..
 
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9

(Invited) Al-Al Waferbonding Process Development for Hetero..:

Schulze, Sebastian ; Wietstruck, Matthias ; Voß, Thomas.
ECS Transactions.  112 (2023)  1 - p. 25-36 , 2023
Link: https://doi.org/10.1149/..
 
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10

Broadband Hetero-Integration of InP Chiplets on SiGe BiCMOS..:

, In: 2023 IEEE/MTT-S International Microwave Symposium - IMS 2023,
Rausch, Marko ; Wietstruck, Matthias ; Stolmacker, Christoph... - p. 466-469 , 2023
Link: https://doi.org/10.1109/..
 
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11

Heterointegration of mm-Wave InP-HBT Power Amplifier Chiple..:

, In: 2023 18th European Microwave Integrated Circuits Conference (EuMIC),
Yacoub, Hady ; Rausch, Marko ; Stolmacker, Christoph... - p. 169-172 , 2023
Link: https://doi.org/10.23919..
 
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12

Gain enhancement of BiCMOS on-chip sub-THz antennas by mean..:

Stocchi, Matteo ; Cao, Zhibo ; Joseph, Christopher Hardly...
Scientific Reports.  12 (2022)  1 - p. , 2022
Link: https://doi.org/10.1038/..
 
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13

Tungsten grid enhanced thin-film wafer-level encapsulation ..:

, In: 2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP),
Goritz, Alexander ; Wipf, Selin Tolunay ; Drost, Martin... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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14

Influence of Process Parameters on Surface Activated Alumin..:

Schulze, Sebastian ; Vob, T. ; Kruger, P....
IEEE Transactions on Components, Packaging and Manufacturing Technology.  12 (2022)  3 - p. 578-586 , 2022
Link: https://doi.org/10.1109/..
 
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15

Monolithic Integration of a Wafer-Level Thin-Film Encapsula..:

Goritz, Alexander ; Wipf, Selin Tolunay ; Drost, Martin...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  12 (2022)  6 - p. 921-932 , 2022
Link: https://doi.org/10.1109/..
 
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