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2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
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Application of Machine Learning to Recognize Wire Bond Lift..:
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8
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Sitzungsberichte der Akademie der Wissenschaften der DDR ; 1981, 7, N. Mathematik, Naturwissenschaften, Technik
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2022 Photonics & Electromagnetics Research Symposium (PIERS) ,
9
Design of a Health-monitoring Device for Surveillance of Po..:
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2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
10