Wilde, Jurgen
153  Ergebnisse:
Personensuche X
?
 
?
5

Assessment methods for the characterization of flux materia..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Pham, Quang-Duc ; Holle, Norbert ; Wilde, Jurgen - p. 2017-2023 , 2023
 
?
 
?
7

Numerical Evaluation of Sintered Silver Die Attachments Bas..:

Gharaibeh, Mohammad A. ; Wilde, Jürgen
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  8 - p. 1187-1201 , 2023
 
?
8

Effect of microstructural evolution during dry sliding on t..:

Gassner, Andreas ; Palkowski, Heinz ; Müller, Claas..
International Journal of Materials Research.  113 (2022)  9 - p. 820-832 , 2022
 
?
9

Assembly and interconnection technology for high-temperatur..:

Kohler, Fabian ; Farina, Monika ; Schulz, Michal..
Journal of Sensors and Sensor Systems.  11 (2022)  1 - p. 83-97 , 2022
 
?
12

Influence analysis of the packaging technology for piezoele..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
 
?
13

Characterization of Wetting behavior of commercial flux sys..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Pham, Quang-Duc ; Holle, Norbert ; Wilde, Jurgen - p. 466-472 , 2022
 
1-15