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2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ,
2
D-Band Flip-Chip Packaging with Wafer-Level Cu-pillar Bumps:
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2020 50th European Microwave Conference (EuMC) ,
5
BiCMOS Through-Silicon Via (TSV) Signal Transition at 240/3..:
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2018 IEEE/MTT-S International Microwave Symposium - IMS ,
9