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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
1
A Novel FOPLP Structure with Chip First & RDL First Process..:
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2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) ,
5
High-Resolution Printing of Redistribution Layers for Fan-O..:
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2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) ,
6
Printing of Micrometer-Size Features on Complex Substrates ..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
7
Ultraprecise Deposition of Micrometer-Size Conductive Featu..:
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2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) ,
8