Witczak, Łukasz
86  Ergebnisse:
Personensuche X
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1

A Novel FOPLP Structure with Chip First & RDL First Process..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Wang, Terry ; Lu, Chih Wei ; Feng, Eric... - p. 1868-1871 , 2024
 
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4

55.3: Deposition of Conductive and Insulating Features at M..:

Wiatrowska, Aneta ; Fiączyk, Karolina ; Kowalczewski, Piotr...
SID Symposium Digest of Technical Papers.  53 (2022)  S1 - p. 551-551 , 2022
 
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5

High-Resolution Printing of Redistribution Layers for Fan-O..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
 
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6

Printing of Micrometer-Size Features on Complex Substrates ..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
 
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7

Ultraprecise Deposition of Micrometer-Size Conductive Featu..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
 
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8

Depositon of Micrometer-Size Features on Complex Substrates..:

, In: 2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS),
 
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9

55‐1: Deposition of Conductive and Insulating Materials at ..:

Łysien, Mateusz ; Witczak, Łukasz ; Gadzalińska, Jolanta...
SID Symposium Digest of Technical Papers.  53 (2022)  1 - p. 723-726 , 2022
 
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13

27.3: Ultraprecise Deposition of Micrometer‐Size Conductive..:

Wiatrowska, Aneta ; Kowalczewski, Piotr ; Fiączyk, Karolina...
SID Symposium Digest of Technical Papers.  52 (2021)  S2 - p. 370-370 , 2021
 
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15

Analysis of the safety of movement of two-wheeled vehicles ..:

Witczak, Łukasz ; Pietruszczak, Daniel ; Perzyński, Tomasz
AUTOBUSY – Technika, Eksploatacja, Systemy Transportowe.  19 (2018)  12 - p. 196-201 , 2018
 
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