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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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A novel FOWLP method to integrate delicate MEMS components:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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A Novel Quantitative Adhesion Measurement Method for Thin P..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
3
Reliability Investigation of Ultra Fine Line, Multi-Layer C..:
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2019 IEEE 69th Electronic Components and Technology Conference (ECTC) ,
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