Woehrmann, Markus
11  Ergebnisse:
Personensuche X
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1

A novel FOWLP method to integrate delicate MEMS components:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Woehrmann, Markus ; Dreissigacker, Marc ; Braun, Tanja.. - p. 1279-1284 , 2023
 
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2

A Novel Quantitative Adhesion Measurement Method for Thin P..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
 
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3

Reliability Investigation of Ultra Fine Line, Multi-Layer C..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
 
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5

Evaluation of WLP Dielectrics for High Voltage Applications:

, In: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC),
Paeck, Marcus ; Woehrmann, Markus ; Toepper, Michael. - p. 1853-1859 , 2019
 
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7

Development and Characterization of a Novel Low-Cost Water-..:

Wang, Bei ; Baeuscher, Manuel ; Hu, Xiaodong...
https://opus4.kobv.de/opus4-htw/frontdoor/index/index/docId/378.  , 2020
 
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9

Polymerization of Thin Film Polymers:

Woehrmann, Markus
https://openresearchlibrary.org/viewer/1505c06e-3331-4c73-8aaa-423b9a61a126.  , 2012
 
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