Wolansky, D.
404  Ergebnisse:
Personensuche X
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3

Development of a Through-Silicon Via (TSV) Process Module f..:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Wietstruck, M. ; Marschmeyer, S. ; Kulse, P.... - p. 2267-2274 , 2018
 
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8

Ring-Enhancing Lesions in MS: Longitudinal Quantification b..:

Qian, P. ; Lancia, S. ; Patnaik, R....
Neurology.  78 (2012)  Meeting Abstracts 1 - p. P03.039-P03.039 , 2012
 
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10

Brain magnetic resonance imaging in adults with asthma:

Parker, J. ; Wolansky, L.J. ; Khatry, D...
Contemporary Clinical Trials.  32 (2011)  1 - p. 86-89 , 2011
 
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11

Ultrathin TiN Membranes as a Technology Platform for CMOS-I..:

Birkholz, M. ; Ehwald, K.-E. ; Kulse, P....
Advanced Functional Materials.  21 (2011)  9 - p. 1652-1656 , 2011
 
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13

Corrosion-resistant metal layers from a CMOS process for bi..:

Birkholz, M. ; Ehwald, K.-E. ; Wolansky, D....
Surface and Coatings Technology.  204 (2010)  12-13 - p. 2055-2059 , 2010
 
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15

Brain Magnetic Resonance Imaging in Asthmatics:

Parker, J.M. ; Khatry, D. ; Wolansky, L.J..
Journal of Allergy and Clinical Immunology.  125 (2010)  2 - p. AB1 , 2010
 
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