E-LIB Suche - Ergebnisse für: Won, Jeong-Yoon

1

Antiosteoarthritic Effects of ChondroT in a Rat Model of Mo..:

Bae, Kil-Joon ; Jeong, Ji-Won ; Choi, Chan-Hun...
Evidence-Based Complementary and Alternative Medicine. 2018 (2018) - p. 1-11 , 2018

Link: https://doi.org/10.1155/..

2

The Effect of Orally Administered Herbal Medicines in Colla..:

Won, Jeong-Yoon ; Jeon, Chae-Heun ; Song, Ho-Joon...
Journal of Korean Medicine Rehabilitation. 27 (2017) 4 - p. 33-53 , 2017

Link: https://doi.org/10.18325..

3

A Review of Studies of Tongue Deviations in Korean Stroke P..:

Park, Young-hwa ; Lim, Bo-ra ; Cho, Jun-ho..
The Journal of Internal Korean Medicine. 38 (2017) 2 - p. 152-163 , 2017

Link: https://doi.org/10.22246..

4

Three cases meniscus injury treated with Shinbaro pharmacop..:

Lee, So Jin ; Yoon, Tae Kyung ; Shin, Soo Ji...
The Acupuncture. 34 (2017) 3 - p. 109-119 , 2017

Link: https://doi.org/10.13045..

5

Evaluation of high-temperature long-term reliability of tra..:

Heo, Min-Haeng ; Seo, Young-Jin ; Yoon, Jeong-Won
Journal of Materials Science: Materials in Electronics. 35 (2024) 19 - p. , 2024

Link: https://doi.org/10.1007/..

6

Optimization of TLPS Bonding Process and Joint Property usi..:

Han, Da-Gyeong ; Lee, Dong-Hwan ; Yoon, Jeong-Won
Journal of Welding and Joining. 42 (2024) 2 - p. 165-173 , 2024

Link: https://doi.org/10.5781/..

7

A comparative study of laser soldering and reflow soldering..:

Jeong, Min-Seong ; Heo, Min-Haeng ; Kim, Jungsoo.
Journal of Materials Science: Materials in Electronics. 34 (2023) 28 - p. , 2023

Link: https://doi.org/10.1007/..

8

Novel and fast transient liquid phase bonding using etched ..:

Heo, Min-Haeng ; Seo, Young-Jin ; Yoon, Jeong-Won
Materials Today Communications. 35 (2023) - p. 105730 , 2023

Link: https://doi.org/10.1016/..

9

Comparative study of solder size and volume effect on prope..:

Seo, Young-Jin ; Heo, Min-Haeng ; Noh, Eun-Chae.
Journal of Materials Science: Materials in Electronics. 34 (2023) 16 - p. , 2023

Link: https://doi.org/10.1007/..

10

Comparative study of laser- and reflow-soldered Sn–3.0Ag–0...:

Lee, Dong-Hwan ; Jeong, Min-Seong ; Yoon, Jeong-Won
Journal of Materials Science: Materials in Electronics. 34 (2023) 3 - p. , 2023

Link: https://doi.org/10.1007/..

11

Microstructures and mechanical properties of ENIG/Sn-3.5Ag/..:

Kim, Hyeon-Tae ; Yoon, Jeong-Won
Journal of Materials Research and Technology. 24 (2023) - p. 4468-4483 , 2023

Link: https://doi.org/10.1016/..

12

Transient liquid phase bonding using Cu foam and Cu–Sn past..:

Heo, Min-Haeng ; Seo, Young-Jin ; Yoon, Jeong-Won
Journal of Materials Research and Technology. 27 (2023) - p. 2856-2867 , 2023

Link: https://doi.org/10.1016/..

13

Microstructures and mechanical properties of ultrasonic-wel..:

Kim, Hyeon-Tae ; Yoon, Jeong-Won
Journal of Materials Science: Materials in Electronics. 34 (2023) 29 - p. , 2023

Link: https://doi.org/10.1007/..

14

Effects of solder ball size and reflow cycles on properties..:

Noh, Eun-Chae ; Seo, Young-Jin ; Yoon, Jeong-Won
Journal of Materials Science: Materials in Electronics. 34 (2023) 33 - p. , 2023

Link: https://doi.org/10.1007/..

15

Investigation of interfacial reactions between Sn–Ag–Bi–In ..:

Yoon, Jeong-Won ; Lee, Chang-Yong ; Lee, Chang-Bae..
International Journal of Materials Research. 94 (2022) 4 - p. 453-457 , 2022

Link: https://doi.org/10.1515/..