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Wu, Fengshun
139  Ergebnisse:
Personensuche X
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1

Production of vaterite via wet carbonation of carbide resid..:

Zhou, Yeqiang ; Wu, Fengshun ; Jinag, Lei...
Cement and Concrete Composites.  150 (2024)  - p. 105549 , 2024
Link: https://doi.org/10.1016/..
 
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2

N, P co-doped graphene-supported monometallic nanoparticles..:

Wu, Fengshun ; Zeng, Li ; Pei, An..
Journal of Materials Chemistry A.  12 (2024)  17 - p. 10300-10306 , 2024
Link: https://doi.org/10.1039/..
 
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3

A method of measuring equivalent parameters of quartz cryst..:

Wan, Yang ; Yang, Zhuoping ; Luan, Xinghe.
Measurement Science and Technology.  35 (2024)  5 - p. 055122 , 2024
Link: https://doi.org/10.1088/..
 
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4

Effects of vaterite and leachate solid residue prepared fro..:

Wu, Fengshun ; Qin, Ji ; Cao, Yi...
Construction and Building Materials.  429 (2024)  - p. 136409 , 2024
Link: https://doi.org/10.1016/..
 
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5

Efficient and stable PtFe alloy catalyst for electrocatalyt..:

Yang, Qian ; Zhang, Sifan ; Wu, Fengshun...
Journal of Energy Chemistry.  90 (2024)  - p. 327-336 , 2024
Link: https://doi.org/10.1016/..
 
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6

Pt-on-CoNi alloy nanoparticles supported on N and P co-dope..:

Wu, Fengshun ; Zeng, Li ; Pei, An..
International Journal of Hydrogen Energy.  63 (2024)  - p. 1128-1136 , 2024
Link: https://doi.org/10.1016/..
 
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7

Simulation of Crack Initiation and Propagation in Solder La..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Qin, Jiaolong ; Wu, Fengshun ; Zhou, Longzao... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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8

An approach to improve compressive strength of cement paste..:

Jiang, Lei ; Wu, Qian ; Huo, Zhen...
Construction and Building Materials.  365 (2023)  - p. 130128 , 2023
Link: https://doi.org/10.1016/..
 
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9

Platinum–palladium-on-reduced graphene oxide as bifunctiona..:

Feng, Yingliang ; Zhu, Lihua ; Pei, An...
Nanoscale.  15 (2023)  42 - p. 16904-16913 , 2023
Link: https://doi.org/10.1039/..
 
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10

Influence of voids in solder layer on the reliability of th..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Jiang, Danlei ; Zhou, Longzao ; Wu, Fengshun... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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11

Simulation of crack propagation in solder layer of IGBT dev..:

Yang, Kai ; Zhou, Longzao ; Wu, Fengshun...
Engineering Fracture Mechanics.  284 (2023)  - p. 109260 , 2023
Link: https://doi.org/10.1016/..
 
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12

Increasing flexural strength of CO2 cured cement paste by C..:

Wu, Fengshun ; You, Xujia ; Wang, Mingming...
Cement and Concrete Composites.  141 (2023)  - p. 105128 , 2023
Link: https://doi.org/10.1016/..
 
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13

Study on Reflow Warpage Deformation of High Pin Density BGA..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Xu, Haoyang ; Lyu, Xianliang ; Wang, Yicai... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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14

Pressure Sintering of Micro-Silver Joints in SiC Power Devi..:

Yang, Guang ; Lee, Ee Lynn ; Yang, Kai...
Journal of Electronic Materials.  53 (2023)  3 - p. 1313-1332 , 2023
Link: https://doi.org/10.1007/..
 
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15

Effect of remelting heat treatment on the microstructure an..:

Wan, Yang ; Zhou, Longzao ; Wu, Fengshun
Scientific Reports.  12 (2022)  1 - p. , 2022
Link: https://doi.org/10.1038/..
 
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