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Wunderle, Bernhard
87  Ergebnisse:
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1

Precise Adverse Weather Characterization by Deep-Learning-B..:

Kettelgerdes, Marcel ; Sarmiento, Nicolas ; Erdogan, Hüseyin..
Remote Sensing.  16 (2024)  13 - p. 2407 , 2024
Link: https://doi.org/10.3390/..
 
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2

Reduced-Order Model for Solder Balls – Potential of project..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Feuchter, Mike ; Baumgartl, Hanna ; Hanke, Martin.. - p. 1-8 , 2024
Link: https://doi.org/10.1109/..
 
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3

Finite Element Simulation of Accelerated Stress Testing and..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Mohammadi, Arash ; Boldeiu, George ; Vasilache, Dan.. - p. 1-9 , 2024
Link: https://doi.org/10.1109/..
 
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4

Fatigue behavior of aluminum and copper metallization for S..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Losbichler, Daniel ; Klingler, Markus ; Orso, Steffen. - p. 1-8 , 2024
Link: https://doi.org/10.1109/..
 
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5

Enhancing Defect Detection Using Lock In Thermography:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Mohamed, Doaa ; May, Daniel ; Pareek, Kaushal Arun.. - p. 1-9 , 2024
Link: https://doi.org/10.1109/..
 
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6

Design and Simulation of a High Cycle Fatigue Vibration Tes..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Walther, David ; Mohammadi, Arash ; Arnold, Jorg. - p. 1-8 , 2024
Link: https://doi.org/10.1109/..
 
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7

Multi-purpose Thermal Test Vehicle for Experimental Investi..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Schacht, Ralph ; Majed, Ben ; Gruen, Tobias.. - p. 1-7 , 2024
Link: https://doi.org/10.1109/..
 
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8

CoolStar: A New Approach to Automotive HPC Cooling with Imp..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Erol, Baris ; May, Daniel ; Wunderle, Bernhard - p. 1-10 , 2024
Link: https://doi.org/10.1109/..
 
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9

Synthetic data generation using finite element method to pr..:

Pareek, Kaushal Arun ; May, Daniel ; Meszmer, Peter..
Journal of Intelligent Manufacturing.  , 2024
Link: https://doi.org/10.1007/..
 
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10

Metal-based Direct Multi-jet Impingement Cooling Solution f..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Moloudi, Reza ; Grun, Tobias ; Verleysen, Willem... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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11

Modelling Creep Behaviour in Sintered Silver using User-Pro..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Forndran, Freerik ; Heilmann, Jens ; Metzler, Martin.. - p. 1-9 , 2023
Link: https://doi.org/10.1109/..
 
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12

Automotive LiDAR Based Precipitation State Estimation Using..:

, In: 2023 29th International Conference on Mechatronics and Machine Vision in Practice (M2VIP),
Kettelgerdes, Marcel ; Pandey, Amit ; Unruh, Denis... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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13

Lifetime modeling of copper metallization for SiC power ele..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Losbichler, Daniel ; Klingler, Markus ; Orso, Steffen. - p. 1-9 , 2023
Link: https://doi.org/10.1109/..
 
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14

Development and Evaluation of a Belt Drive Fatigue Tester f..:

, In: 2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC),
Walther, David ; Johrmann, Nathanael ; Arnold, Jorg. - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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15

Physics of failure based lifetime modelling for sintered si..:

Heilmann, Jens ; Wunderle, Bernhard ; Zschenderlein, Uwe..
Microelectronics Reliability.  145 (2023)  - p. 114973 , 2023
Link: https://doi.org/10.1016/..
 
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