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Xianping Chen
1010  Ergebnisse:
Personensuche X
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1

Machine Learning Accelerated Discovery of Functional MXenes..:

Li, Xiaowen ; Qiu, Jian ; Cui, Heping...
ACS Applied Materials & Interfaces.  16 (2024)  10 - p. 12731-12743 , 2024
Link: https://doi.org/10.1021/..
 
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2

An Improved Evaluation Method for the Short-Circuit Withsta..:

Liu, Renkuan ; Li, Hui ; Yao, Ran...
IEEE Transactions on Electron Devices.  71 (2024)  1 - p. 702-708 , 2024
Link: https://doi.org/10.1109/..
 
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3

A rapid-sintering Cu-Cu joints with ultrahigh shear strengt..:

Dai, Dongfang ; Qian, Jing ; Li, Jincheng...
Materials Science in Semiconductor Processing.  178 (2024)  - p. 108405 , 2024
Link: https://doi.org/10.1016/..
 
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4

Study on Characteristics and UIS of Hexagonal Planar SiC VD..:

Luo, Hou-Cai ; Wu, Huan ; Zhang, Jing-Ping...
IEEE Transactions on Device and Materials Reliability.  , 2024
Link: https://doi.org/10.1109/..
 
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5

Accurate current measurement method in high frequency hybri..:

Jiang, Peixuan ; Gao, Bo ; Gao, Yuheng...
IEICE Electronics Express.  21 (2024)  11 - p. 20240058-20240058 , 2024
Link: https://doi.org/10.1587/..
 
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6

A first-principles study of the adsorption mechanism of NO2..:

Liu, Xiaodong ; Guo, Haojie ; Wang, Jia...
New Journal of Chemistry.  47 (2023)  3 - p. 1413-1421 , 2023
Link: https://doi.org/10.1039/..
 
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7

Lifetime prediction for press pack IGBT device by consideri..:

Yao, Ran ; Duan, Zeyu ; Li, Hui...
Microelectronics Reliability.  145 (2023)  - p. 114984 , 2023
Link: https://doi.org/10.1016/..
 
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8

Investigation of Short-Circuit Failure Mechanism in 1.2kV S..:

, In: 2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS),
Luo, Houcai ; Wu, Huan ; Zhang, Jingping.. - p. 1879-1884 , 2023
Link: https://doi.org/10.1109/..
 
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9

Pyrolyzed Silk Carbon Fabric-Enabled Wearable Functional Ac..:

Tao, Lu-Qi ; Wang, Guanya ; Sun, Hao...
IEEE Transactions on Electron Devices.  70 (2023)  3 - p. 1243-1249 , 2023
Link: https://doi.org/10.1109/..
 
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10

Thermal Stress Analysis and Control Method for Surface Acou..:

Xue, Xufeng ; Cui, Baile ; Chen, Xianping...
Sensors.  23 (2023)  21 - p. 8748 , 2023
Link: https://doi.org/10.3390/..
 
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11

Design of a Miniature High-Gain Quasi-Resonant Flyback Conv..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Jiang, Peixuan ; Yang, Renbin ; Wang, Jialu... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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12

The formation of Cu-Cu joints by low temperature sintering ..:

Dai, Dongfang ; Li, Jincheng ; Qian, Jing...
Materials Letters.  339 (2023)  - p. 134087 , 2023
Link: https://doi.org/10.1016/..
 
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13

Investigation of Unclamped Inductive Switch Characteristics..:

Wu, Huan ; Luo, Houcai ; Zhang, Jingping...
IEEE Transactions on Electron Devices.  70 (2023)  3 - p. 1181-1187 , 2023
Link: https://doi.org/10.1109/..
 
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14

Improvement of the solderability of aluminum alloy, nickel,..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Li, Jincheng ; Qian, Jing ; Dai, Dongfang... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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15

One-step laser synthesis platinum nanostructured 3D porous ..:

Wang, Ying ; Guo, Haojie ; Yuan, Min...
Talanta.  257 (2023)  - p. 124362 , 2023
Link: https://doi.org/10.1016/..
 
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