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Xie, Dongji
19  Ergebnisse:
Personensuche X
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1

Pad Cratering and Pin Pull Strength for Large BGA and Conne..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Xie, Dongji ; Hai, Joe ; Zou, Vivienne.. - p. 1468-1472 , 2024
Link: https://doi.org/10.1109/..
 
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2

New Methodology Assessment of Copper Trace and Solder Joint..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Khaldarov, Valeriy ; Zhang, Andy ; Xie, Dongji... - p. 412-419 , 2023
Link: https://doi.org/10.1109/..
 
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3

A Board Level Vibration Test Method for Electronic Industry..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Xie, Dongji ; Lee, Jeffrey ; Khaldarov, Valeriy... - p. 307-315 , 2023
Link: https://doi.org/10.1109/..
 
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4

A New Vibration Test Method for Automotive and Consumer Ele..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Xie, Dongji ; Zhang, Andy ; Kelly, Brian... - p. 289-296 , 2023
Link: https://doi.org/10.1109/..
 
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5

Solder Joint Fatigue Studies Subjected to Board-level Rando..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Khaldarov, Valeriy ; Zhang, Andy ; Xie, Dongji... - p. 1777-1784 , 2022
Link: https://doi.org/10.1109/..
 
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6

Module Used in Robotaxi and Autonomous Truck Applications:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Xie, Dongji ; Hai, Joe ; Huang, Jack... - p. 769-773 , 2020
Link: https://doi.org/10.1109/..
 
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7

Failure Mechanism and Testing of PCB Pad Cratering:

Xie, Dongji ; Cai, Miao ; Wu, Boyi...
ECS Transactions.  34 (2011)  1 - p. 997-1002 , 2011
Link: https://doi.org/10.1149/..
 
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8

Evaluation of reliability and metallurgical integrity of wi..:

Rooney, Daniel T. ; Gullo, Louis ; Xie, Dongji..
Microelectronics Reliability.  47 (2007)  12 - p. 2152-2160 , 2007
Link: https://doi.org/10.1016/..
 
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9

Materials characterization of the effect of mechanical bend..:

Rooney, Daniel T ; Todd Castello, N ; Cibulsky, Mike..
Microelectronics Reliability.  44 (2004)  2 - p. 275-285 , 2004
Link: https://doi.org/10.1016/..
 
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10

Study of immersion silver and tin printed-circuit-board sur..:

Arra, Minna ; Shangguan, Dongkai ; Xie, Dongji...
Journal of Electronic Materials.  33 (2004)  9 - p. 977-990 , 2004
Link: https://doi.org/10.1007/..
 
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11

Materials characterization of the effect of mechanical bend..:

Rooney, Daniel T. ; Todd Castello, N. ; Cibulsky, Mike..
Microelectronics International.  20 (2003)  1 - p. 34-42 , 2003
Link: https://doi.org/10.1108/..
 
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12

Reliability studies and design improvement of mirror image ..:

Xie, Dongji ; Yi, Sammy
Microelectronics Reliability.  42 (2002)  12 - p. 1931-1937 , 2002
Link: https://doi.org/10.1016/..
 
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13

Effects of atomizer outlet style on the flow characteristic..:

Xie, Jun ; Liu, Liansheng ; Pei, Na...
Process Safety and Environmental Protection.  , 2024
Link: https://doi.org/10.1016/..
 
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14

A novel supply chain of straw briquette fuel and the optima..:

Wang, Dongji ; Liu, Liansheng ; Liu, Chunyu...
Energy Policy.  153 (2021)  - p. 112246 , 2021
Link: https://doi.org/10.1016/..
 
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15

Anesthetic management of precise radiotherapy under apnea-l..:

Zhang, Shilong ; Zhao, Bin ; Chen, Dongji...
Journal of International Medical Research.  49 (2021)  3 - p. 030006052199026 , 2021
Link: https://doi.org/10.1177/..
 
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