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2023 Optical Fiber Communications Conference and Exhibition (OFC) ,
4
Broadband High-Performance 2×2 MMI 3-dB Coupler Enabled by ..:
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3D Microelectronic Packaging; Springer Series in Advanced Microelectronics ,
14
Interconnect Quality and Reliability of 3D Packaging:
, In:
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2020 IEEE Photonics Conference (IPC) ,
15