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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Next Generation Large Size High Interconnect Density CoWoS-..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Analysis of Package-to-System Interaction on Thermal Perfor..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
3
Signal and Power Integrity Performance of CoWoS-R in Chiple..:
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2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) ,
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Thermal Challenges for HPC 3DIC Packages and Systems:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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