Yan, Yanfu
595  Ergebnisse:
Personensuche X
?
1

On Improving Management of Duplicate Video-Based Bug Report:

, In: Proceedings of the 2024 IEEE/ACM 46th International Conference on Software Engineering: Companion Proceedings,
Yan, Yanfu - p. 201-203 , 2024
 
?
2

On Improving Management of Duplicate Video-Based Bug Report:

, In: 2024 IEEE/ACM 46th International Conference on Software Engineering: Companion Proceedings (ICSE-Companion),
Yan, Yanfu - p. 201-203 , 2024
 
?
3

Semantic GUI Scene Learning and Video Alignment for Detecti..:

, In: Proceedings of the IEEE/ACM 46th International Conference on Software Engineering,
Yan, Yanfu ; Cooper, Nathan ; Chaparro, Oscar.. - p. 1-13 , 2024
 
?
4

Semantic GUI Scene Learning and Video Alignment for Detecti..:

, In: 2024 IEEE/ACM 46th International Conference on Software Engineering (ICSE),
Yan, Yanfu ; Cooper, Nathan ; Chaparro, Oscar.. - p. 2868-2880 , 2024
 
?
5

ACER: An AST-based Call Graph Generator Framework:

, In: 2023 IEEE 23rd International Working Conference on Source Code Analysis and Manipulation (SCAM),
Chen, Andrew ; Yan, Yanfu ; Poshyvanyk, Denys - p. 254-259 , 2023
 
?
6

Fine-Grained Categorization From RGB-D Images:

Tan, Yanhao ; Rahman, Mohammad Muntasir ; Yan, Yanfu...
IEEE Transactions on Multimedia.  24 (2022)  - p. 917-928 , 2022
 
?
7

Light Attention Embedding for Facial Expression Recognition:

Wang, Cong ; Xue, Jian ; Lu, Ke.
IEEE Transactions on Circuits and Systems for Video Technology.  32 (2022)  4 - p. 1834-1847 , 2022
 
?
10

R-FENet: A Region-based Facial Expression Recognition Metho..:

, In: Proceedings of the 1st International Workshop on Human-centric Multimedia Analysis,
Wang, Cong ; Lu, Ke ; Xue, Jian. - p. 43-51 , 2020
 
?
11

Dense Attention Network for Facial Expression Recognition i..:

, In: Proceedings of the ACM Multimedia Asia,
Wang, Cong ; Lu, Ke ; Xue, Jian. - p. 1-6 , 2019
 
?
13

Hydrothermal solvothermal synthesis potassium sodium niobat..:

Li, Haitao ; Yan, Yanfu ; Wang, Guangxin...
Journal of Materials Science: Materials in Electronics.  29 (2017)  1 - p. 746-752 , 2017
 
?
14

Intermetallic growth study at Sn–3.0Ag–0.5Cu/Cu solder join..:

Li, Shuai ; Yan, Yan-fu
Journal of Materials Science: Materials in Electronics.  26 (2015)  12 - p. 9470-9477 , 2015
 
?
15

Constitutive modeling on creep deformation for a SnPb-based..:

Shi, Yaowu ; Yan, Yanfu ; Liu, Jianping...
Microelectronics Reliability.  50 (2010)  12 - p. 2020-2025 , 2010
 
1-15