E-LIB Suche - Ergebnisse für: Yandoc, Ding - Sprache DE

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1

Die Tilt Improvement Through Copper Spacers in Solder Paste..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),

Santican, Haima ; Dchar, Ilyas ; Yandoc, Ding.. - p. 1-5 , 2022

Link: https://doi.org/10.1109/..

2

Effect of Die Thickness on the Reliability of Solder Joint ..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),

Dchar, Ilyas ; Yandoc, Ding - p. 776-779 , 2022

Link: https://doi.org/10.1109/..

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