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Yang, Dao-guo
2364  Ergebnisse:
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1

Shear performance of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu sol..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Gui, Jun ; Li, Xing-Min ; Li, Wang-Yun... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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2

Tensile performance of line-type microscale Cu/Sn-58Bi/Cu j..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Li, Xing-Min ; Gui, Jun ; Li, Wang-Yun... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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3

Anisotropic mechanical characteristics of Cu6Sn5 micro-cant..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Kuang, Tian-Feng ; Qin, Hong-Bo ; Li, Wang-Yun. - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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4

The influence of phase inhomogeneity on the current density..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Wen, Quan-Zhang ; Guo, Lei ; Qin, Hong-Bo.. - p. 1-5 , 2019
Link: https://doi.org/10.1109/..
 
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5

Junction Temperature Prediction for LED Luminaires Based on..:

Cai, Miao ; Liang, Zhi ; Tian, Kun-Miao...
IEEE Access.  7 (2019)  - p. 119755-119764 , 2019
Link: https://doi.org/10.1109/..
 
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6

Shear performance of microscale BGA structure Cu/Sn-3.0Ag-0..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Li, Wang-Yun ; Peng, Guan-Qiang ; Cheng, Tian-Xiang... - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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7

The study on elastic properties of Cu3Sn under pressure via..:

, In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT),
Niu, Fan-Fan ; Luan, Xing-He ; Feng, Chuang... - p. 1207-1211 , 2017
Link: https://doi.org/10.1109/..
 
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8

The electronic properties of zinc-blende GaN, wurtzite GaN ..:

, In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT),
Luan, Xing-He ; Feng, Chuang ; Qin, Hong-Bo.. - p. 1483-1487 , 2017
Link: https://doi.org/10.1109/..
 
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9

Optimization of the fatigue life of Epoxy Molding Compounds..:

, In: 2008 International Conference on Electronic Packaging Technology & High Density Packaging,
Cai, Miao ; Yang, Dao-guo ; Li, Quan-yong. - p. None , 2008
Link: https://doi.org/10.1109/..
 
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10

Species richness and biodiversity significance of alpine mi..:

Liu, Shuo-Ran ; Fornacca, Davide ; Yang, Dao-De...
Journal of Mountain Science.  17 (2020)  4 - p. 907-918 , 2020
Link: https://doi.org/10.1007/..
 
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11

The Impact of Microbial Immune Enteral Nutrition on the Pat..:

shao, Feng ; Xin, Fu-ze ; Yang, Cheng-gang...
Cell Biochemistry and Biophysics.  69 (2013)  2 - p. 357-361 , 2013
Link: https://doi.org/10.1007/..
 
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12

PIAS3 expression in human gastric carcinoma and its adjacen..:

Liu, Liang-ming ; Yan, Ming-guo ; Yang, Dao-hua..
Clinics and Research in Hepatology and Gastroenterology.  35 (2011)  5 - p. 393-398 , 2011
Link: https://doi.org/10.1016/..
 
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13

The expression of protein inhibitor of activated signal tra..:

Liu, Liang-ming ; Yan, Ming-guo ; Yang, Dao-hua..
European Journal of Internal Medicine.  22 (2011)  5 - p. e31-e35 , 2011
Link: https://doi.org/10.1016/..
 
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14

Impact of Hot Carrier Stress on RF Power Characteristics of..:

, In: IEEE MTT-S International Microwave Symposium Digest, 2005.,
Huang, Sheng-Yi ; Chen, Kun-Ming ; Huang, Guo-Wei... - p. 161-164 , 2005
Link: https://doi.org/10.1109/..
 
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15

Formation of colorized silicon by femtosecond laser pulses ..:

Yang, Hong-Dao ; Li, Xiao-Hong ; Li, Guo-Qiang...
Applied Physics A.  104 (2011)  2 - p. 749-753 , 2011
Link: https://doi.org/10.1007/..
 
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