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2024 International Conference on Electronics Packaging (ICEP) ,
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Development of a Sintering Paste Using Cu@Ag Powder for Pow..:
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2024 International Conference on Electronics Packaging (ICEP) ,
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Long-Term Reliability of Sintering Paste Using Ag Coated Cu..:
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2024 International Conference on Electronics Packaging (ICEP) ,
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Thermal Cycle Reliability of BGA Package With Board-Level U..:
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Lecture Notes in Electrical Engineering; Big Data, Machine Learning, and Applications ,
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Multitask Learning-Based Simultaneous Facial Gender and Age..:
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Adjunct Proceedings of the 14th International Conference on Automotive User Interfaces and Interactive Vehicular Applications ,
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