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Yang, Ming-kai
44218  Ergebnisse:
Personensuche X
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1

Numerical Simulation of Mixing Characteristics in the Eccen..:

Fan, De-jun ; Yang, Ming-kai ; Huang, Zhi-gao.
Advances in Polymer Technology.  2019 (2019)  - p. 1-11 , 2019
Link: https://doi.org/10.1155/..
 
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2

Synthesis and Antifungal Activities of Novel Griseofulvin D..:

Bai, Yu-Bin ; Yang, Kai-Ming ; Zhang, Meng...
Journal of Agricultural and Food Chemistry.  72 (2024)  23 - p. 13015-13022 , 2024
Link: https://doi.org/10.1021/..
 
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3

The crystal structure of 4′-chloro-griseofulvin: (2S,6′R)-4..:

Yang, Kai-Ming ; Zhang, Meng ; Li, Yi-Xiang...
Zeitschrift für Kristallographie - New Crystal Structures.  239 (2024)  4 - p. 739-741 , 2024
Link: https://doi.org/10.1515/..
 
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4

Variability Analysis for a Two-station Queueing Network in ..:

Cao, Jian ; Guo, Yong-jiang ; Yang, Kai-ming
Acta Mathematicae Applicatae Sinica, English Series.  40 (2024)  2 - p. 445-466 , 2024
Link: https://doi.org/10.1007/..
 
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5

On the Strong Approximation for a Simple Reentrant Line in ..:

Yang, Kai-ming ; Guo, Yong-jiang
Acta Mathematicae Applicatae Sinica, English Series.  40 (2024)  3 - p. 823-839 , 2024
Link: https://doi.org/10.1007/..
 
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6

Hybrid Substrate With Ultralarge Organic Interposer for Het..:

Lau, John H. ; Lin, Curry ; Liu, Hsing-Ning...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  9 - p. 1371-1379 , 2023
Link: https://doi.org/10.1109/..
 
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7

Characterization of Low Loss Dielectric Materials for High-..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lee, Tzu Nien ; Lau, John H ; Ko, Cheng-Ta... - p. 2222-2229 , 2022
Link: https://doi.org/10.1109/..
 
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8

Characterization of Low-Loss Dielectric Materials for High-..:

Lee, Tzu-Nien ; Lau, John-H ; Ko, Cheng-Ta...
Materials.  15 (2022)  7 - p. 2396 , 2022
Link: https://doi.org/10.3390/..
 
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9

High-Density Hybrid Substrate for Heterogeneous Integration:

Peng, Tony Chia-Yu ; Lau, John H. ; Ko, Cheng-Ta...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  12 (2022)  3 - p. 469-478 , 2022
Link: https://doi.org/10.1109/..
 
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10

Fan-Out RDL-first Panel-Level Packaging for Heterogeneous I..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Lau, John H ; Ko, Cheng-Ta ; Yang, Kai-Ming... - p. 339-347 , 2020
Link: https://doi.org/10.1109/..
 
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11

Fan-In Panel-Level with Multiple Diced Wafers Packaging:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Lau, John H ; Ko, Cheng-Ta ; Tseng, Tzvy-Jang... - p. 1146-1153 , 2020
Link: https://doi.org/10.1109/..
 
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12

Non-Planarization Cu-Cu Direct Bonding and Gang Bonding wit..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Chou, Tzu-Chieh ; Yang, Kai-Ming ; Li, Jian-Chen... - p. 5.5.1-5.5.4 , 2019
Link: https://doi.org/10.1109/..
 
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13

A hyperscalar dual-core architecture for embedded systems:

Chiu, Jih-Ching ; Yang, Kai-Ming ; Chou, Yu-Liang
Microprocessors and Microsystems.  37 (2013)  8 - p. 929-940 , 2013
Link: https://doi.org/10.1016/..
 
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14

High-speed low-power multiplexer-based selector for priorit..:

Chiu, Jih-ching ; Yang, Kai-ming
Computers & Electrical Engineering.  39 (2013)  2 - p. 202-213 , 2013
Link: https://doi.org/10.1016/..
 
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15

A relation-exchanging buffering mechanism for instruction a..:

Chiu, Jih-Ching ; Yang, Kai-Ming ; Chou, Yu-Liang.
Computers & Electrical Engineering.  39 (2013)  4 - p. 1129-1141 , 2013
Link: https://doi.org/10.1016/..
 
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