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2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
9
Alternative 3D Double Side Molded SiP for 5G Communication:
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2022 5th World Conference on Mechanical Engineering and Intelligent Manufacturing (WCMEIM) ,
11
Design and Analysis of Paver Walking Hydraulic System Based..:
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2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
12