Yang-Chin Kao
4557  Ergebnisse:
Personensuche X
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11

Investigation of Wafer Warpage Evolution Baesd on Fan-Out C..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Yang, Hung-Chun ; Lai, Wei-Hong ; Kao, Chin-Li.. - p. 151-152 , 2024
 
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13

Post-Buckling Analysis for Addressing Asymmetric Warping of..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Chen, Chia-Yu ; Lee, Yu-Ching ; Chen, Kuo-Shen... - p. 265-266 , 2023
 
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