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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
1
Transient Thermal Characterization and Analysis for Next Ge..:
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2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) ,
2
2.5D Silicon optical interposer for 400 Gbps electronic-pho..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
4
Assembly process characterization of 3D Stacking of Heterog..:
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2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ,
5
Process and Reliability of Large Fan-Out Wafer Level Packag..:
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2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ,
6