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2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
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Analysis of Underfill-Polymer Interfacial Adhesive Strength..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
2
Viscoelastic Modeling for Heterogeneous Fan-out Wafer Moldi..:
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2023 57th Asilomar Conference on Signals, Systems, and Computers ,
6
Offline Reinforcement Learning for Wireless Network Optimiz..:
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2022 56th Asilomar Conference on Signals, Systems, and Computers ,
8