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Yeh, Teng-Hao
2316  Ergebnisse:
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1

Analog Computing in Memory (CIM) Technique for General Matr..:

, In: 2022 International Electron Devices Meeting (IEDM),
Wei, Ming-Liang ; Lue, Hang-Ting ; Ho, Shu-Yin... - p. 33.3.1-33.3.4 , 2022
Link: https://doi.org/10.1109/..
 
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2

A 3D Stackable DRAM: Capacitor-less Three-Wordline Gate-Con..:

, In: 2022 International Electron Devices Meeting (IEDM),
Chen, Wei-Chen ; Lue, Hang-Ting ; Wu, Meng-Yan... - p. 26.3.1-26.3.4 , 2022
Link: https://doi.org/10.1109/..
 
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3

Study of Analog Weights Based Computing-in-Memory (CIM) usi..:

, In: 2022 IEEE Silicon Nanoelectronics Workshop (SNW),
Lue, Hang-Ting ; Fu, Chung-Hao ; Hsu, Tzu-Hsuan... - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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4

Investigation of Methods That Greatly Improve 3D NOR Flash ..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Lue, Hang-Ting ; Hsu, Tzu-Hsuan ; Lo, Chieh... - p. 10.3.1-10.3.4 , 2021
Link: https://doi.org/10.1109/..
 
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5

A Vertical 2T NOR (V2T) Architecture to Enable Scaling and ..:

, In: 2020 IEEE Symposium on VLSI Technology,
Lue, Hang-Ting ; Hsu, Tzu-Hsuan ; Yeh, Teng-Hao... - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
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6

An Approach of 3D NAND Flash Based Nonvolatile Computing-In..:

, In: 2020 IEEE International Memory Workshop (IMW),
Hsu, Po-Kai ; Du, Pei-Ying ; Lo, Chieh Roger... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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7

Study of the Walk-Out Effect of Junction Breakdown Instabil..:

, In: 2020 IEEE International Reliability Physics Symposium (IRPS),
Lo, Chieh Roger ; Yeh, Teng-Hao ; Chen, Wei-Chen... - p. 1-6 , 2020
Link: https://doi.org/10.1109/..
 
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8

An Extremely Scaled Hemi-Cylindrical (HC) 3D NAND Device wi..:

, In: 2020 IEEE Symposium on VLSI Technology,
Du, Pei-Ying ; Lue, Hang-Ting ; Yeh, Teng-Hao... - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
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9

Optimal Design Methods to Transform 3D NAND Flash into a Hi..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Lue, Hang-Ting ; Hsu, Po-Kai ; Wei, Ming-Liang... - p. 38.1.1-38.1.4 , 2019
Link: https://doi.org/10.1109/..
 
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10

A Novel Double-Density Hemi-Cylindrical (HC) Structure to P..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Lue, Hang-Ting ; Jiang, Yu-Wei ; Hung, Min-Feng... - p. 28.2.1-28.2.4 , 2019
Link: https://doi.org/10.1109/..
 
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11

Drying Shrinkage and Mechanical Strength of Cementitious Co..:

Yeh, Chin-Hao ; Wu, Jyh-Horng ; Yang, Teng-Chun
Journal of Natural Fibers.  21 (2024)  1 - p. , 2024
Link: https://doi.org/10.1080/..
 
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12

Effects of vacuum heat-treated waste bamboo fibers on the d..:

Yeh, Chin-Hao ; Yang, Teng-Chun
Case Studies in Construction Materials.  19 (2023)  - p. e02646 , 2023
Link: https://doi.org/10.1016/..
 
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13

Discovery of Potential Neuroprotective Agents against Pacli..:

Chen, Yi-Fan ; Wu, Chien-Huang ; Chen, Li-Hsien...
Journal of Medicinal Chemistry.  65 (2022)  6 - p. 4767-4782 , 2022
Link: https://doi.org/10.1021/..
 
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14

Effects of flexural configuration and thermal modification ..:

Yang, Teng-Chun ; Chung, Min-Jay ; Yeh, Chin-Hao
Wood Material Science & Engineering.  18 (2022)  2 - p. 402-411 , 2022
Link: https://doi.org/10.1080/..
 
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15

Characteristic Properties of a Bamboo-Based Board Combined ..:

Yang, Yu-Hsuan ; Chung, Min-Jay ; Wu, Tung-Lin..
Polymers.  14 (2022)  3 - p. 560 , 2022
Link: https://doi.org/10.3390/..
 
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