Yih, Jonathan A.
185  Ergebnisse:
Personensuche X
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1

Shrinkage / stress reduction and mechanical properties impr..:

Bacchi, Atais ; Yih, Jonathan A. ; Platta, Jacqueline..
Journal of the Mechanical Behavior of Biomedical Materials.  78 (2018)  - p. 235-240 , 2018
 
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5

Planck Intermediate Results. XI: The gas content of dark ma..:

Planck Collaboration ; Ade, P. A. R ; Aghanim, N...
https://orbit.dtu.dk/en/publications/bbf14e48-dd81-470f-b979-f7ec4e8d93f3.  , 2013
 
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7

High-Density Embedded 3-D Stackable Via RRAM in 16-nm FinFE..:

Huang, Yao-Hung ; Hsieh, Yu-Cheng ; Lin, Yu-Cheng...
IEEE Transactions on Electron Devices.  71 (2024)  6 - p. 3614-3619 , 2024
 
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8

A New Ultra-Low Voltage Metal Fuse for High Density OTP App..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Wang, Li-Yu ; Chen, Kuan-Ju ; Yuh, Perng-Fei... - p. 1-2 , 2024
 
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9

15.3 A 3nm FinFET 4.3GHz 21.1Mb/mm2 Double-Pumping 1-Read a..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
 
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10

15.7 A 32Mb RRAM in a 12nm FinFet Technology with a 0.0249μ..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Huang, Yi-Cheng ; Liu, Shang-Hsuan ; Chen, Hsu-Shun... - p. 288-290 , 2024
 
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15.9 A 16nm 16Mb Embedded STT-MRAM with a 20ns Write Time, ..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Lin, Ku-Feng ; Noguchi, Hiroki ; Shih, Yi-Chun... - p. 292-294 , 2024
 
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12

Efficient Processing of MLPerf Mobile Workloads Using Digit..:

Sun, Xiaoyu ; Cao, Weidong ; Crafton, Brian...
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.  43 (2024)  4 - p. 1191-1205 , 2024
 
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34.4 A 3nm, 32.5TOPS/W, 55.0TOPS/mm2 and 3.78Mb/mm2 Fully-D..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Fujiwara, Hidehiro ; Mori, Haruki ; Zhao, Wei-Chang... - p. 572-574 , 2024
 
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14

Tinnitus after COVID-19 vaccination: Findings from the vacc..:

Yih, W. Katherine ; Duffy, Jonathan ; Su, John R....
American Journal of Otolaryngology.  45 (2024)  6 - p. 104448 , 2024
 
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