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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
4
FOWLP AiP for SOTM Applications:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
7
Design, Process and Reliability of Face-up 2-layer molded F..:
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2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) ,
8
Si-based Hybrid Micro-cooler Fabrication Process Developmen:
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2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) ,
15