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2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) ,
8
Galvanic displacement deposition of Ag using citric acid fo..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
9
Copper-to-Copper Direct Bonding Process Using Current-Induc..:
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2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) ,
13
Selective Cu electrodeposition for Through Glass Via (TGV):
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2023 International Conference on Electronics Packaging (ICEP) ,
14
Advanced Metallizations for Next Generation Semiconductor P..:
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2022 IEEE International Interconnect Technology Conference (IITC) ,
15