E-LIB Suche - Ergebnisse für: Yoon, Seung Wook

1

Fully Automatic Controlled Environment Agriculture using Ma..:

Yoon, Seung wook ; Nam, Sukyeong
Journal of Student Research. 12 (2023) 1 - p. , 2023

Link: https://doi.org/10.47611..

2

Advanced Package FAB Solutions(APFS) for Chiplet Integratio:

, In: 2022 International Electron Devices Meeting (IEDM),

Yoon, Seung Wook - p. 3.6.1-3.6.4 , 2022

Link: https://doi.org/10.1109/..

3

Fine-Pitch Interconnection and Highly Integrated Assembly P..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),

Hsu, Ian ; Chen, Chi-Yuan ; Lin, Stanley... - p. 867-872 , 2020

Link: https://doi.org/10.1109/..

4

Study of Low-Temperature Thermocompression Bonding in Ag-In..:

Made, Riko I ; Gan, Chee Lip ; Yan, Li Ling...
Journal of Electronic Materials. 38 (2008) 2 - p. 365-371 , 2008

Link: https://doi.org/10.1007/..

5

Influence of thickness on nanomechanical behavior of Black ..:

Sekhar, V. N. ; Chai, T. C. ; Balakumar, S....
Journal of Materials Science: Materials in Electronics. 20 (2008) 1 - p. 74-86 , 2008

Link: https://doi.org/10.1007/..

6

Package Development for MEMS Based 3D Micro-Mirror Optical ..:

, In: 2007 9th Electronics Packaging Technology Conference,

Kelvin, Chen Wei Sheng ; Premachandran, C.S. ; Ratmin, Ahmad Khairyanto Bin.. - p. None , 2007

Link: https://doi.org/10.1109/..

7

A thick photoresist process for advanced wafer level packag..:

Rao, Vempati Srinivasa ; Kripesh, Vaidyanathan ; Yoon, Seung Wook.
Journal of Micromechanics and Microengineering. 16 (2006) 9 - p. 1841-1846 , 2006

Link: https://doi.org/10.1088/..

8

Electromigration in flip chip solder joints having a thick ..:

Nah, Jae-Woong ; Suh, J. O. ; Tu, K. N....
Journal of Applied Physics. 100 (2006) 12 - p. , 2006

Link: https://doi.org/10.1063/..

9

Under bump metallurgy study on copper/low-k dielectrics for..:

Yoon, Seung Wook ; Kripesh, Vaidyanathan ; Jeffery, Su Young Ji.
Journal of Electronic Materials. 33 (2004) 10 - p. 1144-1155 , 2004

Link: https://doi.org/10.1007/..

10

Interfacial reaction and solder joint reliability of Pb-fre..:

Yoon, Seung Wook ; Park, Chang Jun ; Hong, Sung Hak...
Journal of Electronic Materials. 29 (2000) 10 - p. 1233-1240 , 2000

Link: https://doi.org/10.1007/..

11

Investigation of the phase equilibria in the Sn-Bi-In alloy..:

Yoon, Seung Wook ; Rho, Byung-Sup ; Lee, Hyuck Mo..
Metallurgical and Materials Transactions A. 30 (1999) 6 - p. 1503-1515 , 1999

Link: https://doi.org/10.1007/..

12

Interfacial reaction between Sn-1Bi-5In-9Zn solder and Cu s..:

Yoon, Seung Wook ; Choi, Won Kyoung ; Lee, Hyuck Mo
Scripta Materialia. 40 (1999) 3 - p. 327-332 , 1999

Link: https://doi.org/10.1016/..

13

Calculation of surface tension and wetting properties of Sn..:

Yoon, Seung Wook ; Choi, Won Kyoung ; Lee, Hyuck Mo
Scripta Materialia. 40 (1999) 3 - p. 297-302 , 1999

Link: https://doi.org/10.1016/..

14

Thermodynamic prediction of interface phases at Cu/solder j..:

Lee, Hyuck Mo ; Yoon, Seung Wook ; Lee, Byeong-Joo
Journal of Electronic Materials. 27 (1998) 11 - p. 1161-1166 , 1998

Link: https://doi.org/10.1007/..

15

A thermodynamic study of phase equilibria in the Sn-Bi-Pb s..:

Yoon, Seung Wook ; Lee, Hyuck Mo
Calphad. 22 (1998) 2 - p. 167-178 , 1998

Link: https://doi.org/10.1016/..