Yu, Seong Hwan
9823  Ergebnisse:
Personensuche X
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3

Single and Multi NPU Chiplet Heterogeneous Integration pack..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Kang, Lewis ; Kim, Jay ; Lee, Bruce... - p. 1603-1608 , 2024
 
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6

Mechanical and Insulation Properties of Elastomer-Toughened..:

, In: 2023 International Symposium on Electrical Insulating Materials (ISEIM),
Yu, Seunggun ; Lee, Seong Hwan ; Kim, Do-Kyun... - p. 1-4 , 2023
 
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7

Polypropylene nanocomposites doped with carbon nanohorns fo..:

Kwon, Taehoon ; Lee, Seong Hwan ; Kim, Ji Hoon...
Advanced Composites and Hybrid Materials.  6 (2023)  5 - p. , 2023
 
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11

Polystyrene: A Self-Dispersing, Ultralow Loading Additive f..:

Lee, Seong Hwan ; Kim, Do-Kyun ; Kwon, Ik-Su...
ACS Applied Polymer Materials.  5 (2022)  1 - p. 165-171 , 2022
 
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12

Low-Temperature-Toughened Polypropylene Blends with Highly ..:

Kim, Do-Kyun ; Lee, Seong Hwan ; Hong, Shin-Ki...
ACS Applied Polymer Materials.  4 (2022)  10 - p. 7834-7840 , 2022
 
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14

Interpretable machine learning for early neurological deter..:

Kim, Seong Hwan ; Jeon, Eun-Tae ; Yu, Sungwook...
Journal of the Neurological Sciences.  429 (2021)  - p. 118754 , 2021
 
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