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2020 9th Asia-Pacific Conference on Antennas and Propagation (APCAP) ,
4
FEXT Reduction Using Mushroom Structures Thickened Solderma..:
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2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) ,
7
Study of Thickening Soldermask Coated Microstrip Lines on H..:
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2020 9th Asia-Pacific Conference on Antennas and Propagation (APCAP) ,
8
A U-shaped Complementary Open Loop Defective Ground Structu..:
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2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) ,
10
Far-End Crosstalk Mitigation Using Homogeneous Dielectric S..:
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2019 Cross Strait Quad-Regional Radio Science and Wireless Technology Conference (CSQRWC) ,
12
Far-End Crosstalk Mitigation for Microstrip Lines in High-S..:
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2019 Cross Strait Quad-Regional Radio Science and Wireless Technology Conference (CSQRWC) ,
14