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2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) ,
3
A Novel MIM sandwich structure of the SCM probe for tool in..:
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Springer Series in Reliability Engineering; Interconnect Reliability in Advanced Memory Device Packaging ,
6
Recycling of Noble Metals Used in Memory Packaging:
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Springer Series in Reliability Engineering; Interconnect Reliability in Advanced Memory Device Packaging ,
7
Advanced Memory and Device Packaging:
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Springer Series in Reliability Engineering; Interconnect Reliability in Advanced Memory Device Packaging ,
8
Reliability Simulation and Modeling in Memory Packaging:
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Springer Series in Reliability Engineering; Interconnect Reliability in Advanced Memory Device Packaging ,
9
Interconnects Reliability for Future Cryogenic Memory Appli..:
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Springer Series in Reliability Engineering; Interconnect Reliability in Advanced Memory Device Packaging ,
10
Wearout Reliability-Based Characterization in Memory Packag..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
11
Flip Chip Process Enablement in IC Memory Stacked Die Packa..:
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