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Yuile, Adam
14  Ergebnisse:
Personensuche X
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1

LTCC With Temperature Sensor Array for Monitoring of Reacti..:

Yuile, Adam ; Wiese, Steffen
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  1 - p. 122-129 , 2024
Link: https://doi.org/10.1109/..
 
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2

Simulation of Mechanical Stresses in BaTiO3 Multilayer Cera..:

Yuile, Adam ; Wiss, Erik ; Barth, David.
Materials.  17 (2024)  11 - p. 2702 , 2024
Link: https://doi.org/10.3390/..
 
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3

Thermal Assessment of Soldering MLCC Components:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Wiss, Erik ; Yuile, Adam ; Barth, David. - p. 1-5 , 2024
Link: https://doi.org/10.1109/..
 
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4

Reactive Die Bonding on LTCC Substrates – Analysis by CFD S..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Wiss, Erik ; Yuile, Adam ; Schulz, Alexander.. - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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5

Application of Reactive Bonding Methods on LTCC Substrates:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Wiss, Erik ; Schulz, Alexander ; Yuile, Adam.. - p. 1-6 , 2023
Link: https://doi.org/10.23919..
 
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6

The Simulated Effect of Adding Solder Layers on Reactive Mu..:

Yuile, Adam ; Schulz, Alexander ; Wiss, Erik..
Applied Sciences.  12 (2022)  5 - p. 2397 , 2022
Link: https://doi.org/10.3390/..
 
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7

The influence of thermal ageing on the flow-stress of coppe..:

Yuile, Adam ; Wiese, Steffen
Microelectronics Reliability.  99 (2019)  - p. 197-202 , 2019
Link: https://doi.org/10.1016/..
 
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8

Analysis of selective bonding processes using reactive mult..:

Yuile, Adam ; Schulz, Alexander ; Müller, Jens.
Microsystem technologies -- 1432-1858 -- http://uri.gbv.de/document/gvk:ppn:270128182 -- 1476561-5 -- http://www.bibliothek.uni-regensburg.de/ezeit/?1476561 -- http://link.springer.com/journal/542.  , 2022
Link: https://doi.org/10.1007/..
 
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9

The Simulated Effect of Adding Solder Layers on Reactive Mu..:

Yuile, Adam ; Schulz, Alexander ; Wiss, Erik..
Applied Sciences 12 (5): 2397 (2022).  , 2022
Link: http://nbn-resolving.org..
 
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10

The simulated effect of adding solder layers on reactive mu..:

Yuile, Adam ; Schulz, Alexander ; Wiss, Erik..
Applied Sciences -- 2076-3417 -- http://uri.gbv.de/document/gvk:ppn:737287640 -- 2704225-X -- http://www.mdpi.com/journal/applsci -- http://www.bibliothek.uni-regensburg.de/ezeit/?2704225.  , 2022
Link: https://doi.org/10.3390/..
 
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11

Swept boundary layer transition:

Yuile, Adam
http://livrepository.liverpool.ac.uk/14613/1/SBLT_Thesis_Adam_Yuile_2010.pdf.  ,
Link: http://livrepository.liv..
 
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12

The Simulated Effect of Adding Solder Layers on Reactive Mu..:

Adam Yuile ; Alexander Schulz ; Erik Wiss..
Materials Science and Engineering.  , 2022
Link: https://doi.org/10.3390/..
 
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13

The Simulated Effect of Adding Solder Layers on Reactive Mu..:

Adam Yuile ; Alexander Schulz ; Erik Wiss..
https://www.mdpi.com/2076-3417/12/5/2397.  , 2022
Link: https://doi.org/10.3390/..
 
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14

Users Can Deduce Sensitive Locations Protected by Privacy Z..:

, In: Proceedings of the 2022 CHI Conference on Human Factors in Computing Systems,
Mink, Jaron ; Yuile, Amanda Rose ; Pal, Uma.. - p. 1-21 , 2022
Link: https://dl.acm.org/doi/1..
 
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