Zee, Bernice
8  Ergebnisse:
Personensuche X
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1

Oxygen-Based Microwave Induced Plasma Etching for Epoxy Mol..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Tan, Hong Siang ; Zee, Bernice ; Gan, Chee Lip... - p. 1-6 , 2023
 
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2

Thermal simulations of lock-in-thermography for failure ana..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Qiu, Wen ; Zee, Bernice ; Pey, Kin Leong. - p. 1-6 , 2023
 
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3

Robust Image Processing Software for Void Calculation in Th..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Song, Mei-Hui ; Oh, Zi-Ying ; Lee, Xi-Wen... - p. 1-8 , 2023
 
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4

Novel Submicron Spatial Resolution Infrared Microspectrosco..:

, In: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
 
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5

High-resolution 3D X-ray Microscopy for Structural Inspecti..:

, In: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA),
 
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6

Metallic Trace Contaminant Detection Using SEM/EDX:

, In: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA),
Lee, Aaron ; Zee, Bernice ; Foo, Fang Jie - p. 1-4 , 2019
 
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7

Iterative Delayering and Electrical Fault Isolation for Def..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Siang, Tan Hong ; Bernice, Zee ; Jie, Foo Fang - p. 189-191 , 2019
 
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