E-LIB Suche - Ergebnisse für: Zhang, Sung-Uk

1

Numerical Evaluation of P-Channel MOSFETs Depending on the ..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),

Choi, Na-Yeon ; Zhang, Sung-Uk - p. 1-6 , 2024

Link: https://doi.org/10.1109/..

2

Chip packaging interaction of SiC junction barrier Schottky..:

Zhang, Sung-Uk ; Seok, Ogyun
Energy Reports. 9 (2023) - p. 65-77 , 2023

Link: https://doi.org/10.1016/..

3

Terminal strength test of TO-220 packaged Schottky barrier ..:

Choi, Na-Yeon ; Zhang, Sung-Uk
Microelectronics Reliability. 151 (2023) - p. 115235 , 2023

Link: https://doi.org/10.1016/..

4

Numerical Evaluation of Thermal Resistance for Power MOSFET..:

Choi, Na-Yeon ; Zhang, Sung-Uk
Journal of Electrical Engineering & Technology. 17 (2022) 3 - p. 1915-1920 , 2022

Link: https://doi.org/10.1007/..

5

Progress of Near-Infrared-Based Medical Imaging and Cancer ..:

Mudeng, Vicky ; Ayana, Gelan ; Zhang, Sung-Uk.
Chemosensors. 10 (2022) 11 - p. 471 , 2022

Link: https://doi.org/10.3390/..

6

Classifying Thermal Degradation of Polylactic Acid by Using..:

Zhang, Sung-Uk
Applied Sciences. 10 (2020) 21 - p. 7470 , 2020

Link: https://doi.org/10.3390/..

7

Classifying Degraded Three-Dimensionally Printed Polylactic..:

Zhang, Sung-Uk
Applied Sciences. 9 (2019) 13 - p. 2772 , 2019

Link: https://doi.org/10.3390/..

8

Degradation Classification of 3D Printing Thermoplastics Us..:

Zhang, Sung-Uk
Applied Sciences. 8 (2018) 8 - p. 1224 , 2018

Link: https://doi.org/10.3390/..

9

Temperature-dependent mechanical properties of ABS parts fa..:

Zhang, Sung-Uk ; Han, Jonghyeuk ; Kang, Hyun-Wook
International Journal of Precision Engineering and Manufacturing. 18 (2017) 5 - p. 763-769 , 2017

Link: https://doi.org/10.1007/..

10

Chip package interaction for LED packages:

Zhang, Sung-Uk
Microelectronics Reliability. 63 (2016) - p. 76-81 , 2016

Link: https://doi.org/10.1016/..

11

Quantification of silicone degradation for LED packages usi..:

Zhang, Sung-Uk
Microelectronics Reliability. 55 (2015) 12 - p. 2678-2684 , 2015

Link: https://doi.org/10.1016/..

12

Fatigue life evaluation of wire bonds in LED packages using..:

Zhang, Sung-Uk ; Lee, Bang Weon
Microelectronics Reliability. 54 (2014) 12 - p. 2853-2859 , 2014

Link: https://doi.org/10.1016/..

13

Altered Microenvironmental Regulation of Leukemic and Norma..:

Zhang, Bin ; Ho, Yin Wei ; Huang, Qin...
Cancer Cell. 21 (2012) 4 - p. 577-592 , 2012

Link: https://doi.org/10.1016/..

14

Recognition of adherent polychaetes on oysters and scallops..:

Dong-hyeon Kim ; Se-woon Choe ; Sung-Uk Zhang
https://www.aimspress.com/article/doi/10.3934/era.2023088?viewType=HTML. , 2023

Link: https://doi.org/10.3934/..

15

Chip packaging interaction of SiC junction barrier Schottky..:

Sung-Uk Zhang ; Ogyun Seok
http://www.sciencedirect.com/science/article/pii/S2352484723002135. , 2023

Link: https://doi.org/10.1016/..