E-LIB Suche - Ergebnisse für: Zhongmin, Lai

1

Study on Microstructure and Property of Brazed Joint of AgC..:

Zhongmin, Lai ; Songbai, Xue ; Xianpeng, Han..
Rare Metal Materials and Engineering. 39 (2010) 3 - p. 397-400 , 2010

Link: https://doi.org/10.1016/..

2

Row-ratios and plant density in potato/maize strip-cropping:

Zhongmin, Lai ; Guang, Wen
Field Crops Research. 25 (1990) 1-2 - p. 51-59 , 1990

Link: https://doi.org/10.1016/..

3

Generation of near eutectic phase layer in Sn-15Bi solder j..:

Du, Chengchao ; Wang, Xue ; Lai, Zhongmin
Materials Letters. 191 (2017) - p. 193-195 , 2017

Link: https://doi.org/10.1016/..

4

Microstructure and mechanical properties of Co/Sn-10Bi coup..:

Lai, Zhongmin ; Kong, Xinda ; You, Qingrong.
Microelectronics Reliability. 68 (2017) - p. 69-76 , 2017

Link: https://doi.org/10.1016/..

5

Microstructure and Properties of Sn-10Bi-xCu Solder Alloy/J..:

Lai, Zhongmin ; Ye, Dan
Journal of Electronic Materials. 45 (2016) 7 - p. 3702-3711 , 2016

Link: https://doi.org/10.1007/..

6

Effect of electron flow on the microstructure and mechanica..:

Lai, Zhongmin ; Kong, Xinda ; You, Qingrong
Journal of Materials Science: Materials in Electronics. 28 (2016) 5 - p. 4506-4512 , 2016

Link: https://doi.org/10.1007/..

7

Microstructure and fracture behavior of non eutectic Sn–Bi ..:

Lai, Zhongmin ; Ye, Dan
Journal of Materials Science: Materials in Electronics. 27 (2015) 4 - p. 3182-3192 , 2015

Link: https://doi.org/10.1007/..

8

Microstructure and mechanical properties of Sn–xBi solder a..:

Ye, Dan ; Du, Chengchao ; Wu, Mingfang.
Journal of Materials Science: Materials in Electronics. 26 (2015) 6 - p. 3629-3637 , 2015

Link: https://doi.org/10.1007/..

9

Effect of cooling method and aging treatment on the microst..:

Lai, Zhongmin ; Ye, Dan
Journal of Materials Science: Materials in Electronics. 27 (2015) 2 - p. 1398-1407 , 2015

Link: https://doi.org/10.1007/..

10

Effect of Al on the microstructure and properties of Sn–0.7..:

Lai, Zhongmin ; Ye, Dan
Journal of Materials Science: Materials in Electronics. 27 (2015) 2 - p. 1177-1183 , 2015

Link: https://doi.org/10.1007/..

11

Interfacial microstructure and properties of Sn–0.7Cu–0.05N..:

Zeng, Guang ; Xue, Songbai ; Gao, Lili...
Journal of Alloys and Compounds. 509 (2011) 25 - p. 7152-7161 , 2011

Link: https://doi.org/10.1016/..

12

Sn whisker growth in Sn–9Zn–0.5Ga–0.7Pr lead-free solder:

Ye, Huan ; Xue, Songbai ; Zhang, Liang...
Journal of Alloys and Compounds. 509 (2011) 5 - p. L52-L55 , 2011

Link: https://doi.org/10.1016/..

13

Properties and microstructure of Sn–0.7Cu–0.05Ni solder bea..:

Zeng, Guang ; Xue, Songbai ; Zhang, Liang...
Journal of Materials Science: Materials in Electronics. 22 (2010) 8 - p. 1101-1108 , 2010

Link: https://doi.org/10.1007/..

14

Laser Characteristics of Cladding-Pumped Short Er3+/Yb3+Cod..:

Shan-Hui, Xu ; Zhong-Min, Yang ; Wen-Cheng, Xu...
Chinese Physics Letters. 26 (2009) 1 - p. 014203 , 2009

Link: https://doi.org/10.1088/..

15

Novel two-dimensional boron-centered graphdiyne analogue as..:

Wang, Cong ; Wang, Xin ; Han, Dong-Lai...
International Journal of Hydrogen Energy. 58 (2024) - p. 783-789 , 2024

Link: https://doi.org/10.1016/..