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Zippelius, Andreas
58  Ergebnisse:
Personensuche X
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1

LEDs Lifetime Prediction Modeling: Thermomechanical Simulat..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Akhtar, Mohd Zubair ; Schmid, Maximilian ; Zippelius, Andreas. - p. 1-10 , 2024
Link: https://doi.org/10.1109/..
 
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2

Investigations on High-Power LEDs and Solder Interconnects ..:

Schmid, Maximilian ; Zippelius, Andreas ; Hanß, Alexander..
IEEE Transactions on Device and Materials Reliability.  23 (2023)  3 - p. 419-429 , 2023
Link: https://doi.org/10.1109/..
 
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3

Investigations on High-Power LEDs and Solder Interconnects ..:

Schmid, Maximilian ; Zippelius, Andreas ; Hans, Alexander..
IEEE Transactions on Device and Materials Reliability.  22 (2022)  2 - p. 175-186 , 2022
Link: https://doi.org/10.1109/..
 
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4

Reliability analysis and condition monitoring of SAC+ solde..:

Zippelius, Andreas ; Hanß, Alexander ; Schmid, Maximilian..
Microelectronics Reliability.  129 (2022)  - p. 114461 , 2022
Link: https://doi.org/10.1016/..
 
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5

Predicting thermal resistance of solder joints based on Sca..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Zippelius, Andreas ; Strobl, Tobias ; Schmid, Maximilian... - p. 566-575 , 2022
Link: https://doi.org/10.1109/..
 
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6

Analysis of package design of optic modules for automotive ..:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
Kuhn, Stephan ; Pandey, Amit ; Zippelius, Andreas... - p. 1-6 , 2020
Link: https://doi.org/10.1109/..
 
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7

Comparing prediction methods for LED failure measured with ..:

, In: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Zippelius, Andreas ; Hans, Alexander ; Liu, E... - p. 1-8 , 2020
Link: https://doi.org/10.1109/..
 
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8

Density-wave fronts on the brink of wet granular condensati..:

Zippelius, Andreas ; Huang, Kai
Scientific Reports.  7 (2017)  1 - p. , 2017
Link: https://doi.org/10.1038/..
 
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9

Investigations on High-Power LEDs and Solder Interconnects ..:

Schmid, Maximilian ; Zippelius, Andreas ; Hanß, Alexander..
https://opus4.kobv.de/opus4-haw/frontdoor/index/index/docId/3965.  , 2023
Link: https://opus4.kobv.de/op..
 
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10

Reliability analysis and condition monitoring of SAC+ solde..:

Zippelius, Andreas ; Hanss, Alexander ; Schmid, Maximilian..
https://opus4.kobv.de/opus4-haw/frontdoor/index/index/docId/1971.  , 2022
Link: https://opus4.kobv.de/op..
 
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11

Investigations on High-Power LEDs and Solder Interconnects ..:

Schmid, Maximilian ; Zippelius, Andreas ; Hanss, Alexander..
https://opus4.kobv.de/opus4-haw/frontdoor/index/index/docId/2879.  , 2022
Link: https://opus4.kobv.de/op..
 
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12

Density-wave fronts on the brink of wet granular condensati..:

Zippelius, Andreas ; Huang, Kai
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC5472573/.  , 2017
Link: http://www.ncbi.nlm.nih...
 
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13

Density-wave fronts on the brink of wet granular condensati..:

Zippelius, Andreas ; Huang, Kai
https://epub.uni-bayreuth.de/id/eprint/3806/1/s41598-017-03844-0.pdf.  , 2017
Link: https://epub.uni-bayreut..
 
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14

Density-wave fronts on the brink of wet granular condensati..:

Zippelius, Andreas ; Huang, Kai
http://arxiv.org/abs/1702.06196.  , 2017
Link: http://arxiv.org/abs/170..
 
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15

Density-wave fronts on the brink of wet granular condensati..:

Andreas Zippelius ; Kai Huang
https://doi.org/10.1038/s41598-017-03844-0.  , 2017
Link: https://doi.org/10.1038/..
 
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