Zongbei, Dai
43  Ergebnisse:
Personensuche X
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1

Failure Analysis of Dielectric Material Defects Inside IGBT..:

, In: 2022 4th International Conference on System Reliability and Safety Engineering (SRSE),
Jian, Zhou ; Jiesen, Li ; Zongbei, Dai.. - p. 421-424 , 2022
 
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4

SiC IGBT degradation mechanism investigation under HV-H3TRB..:

Wu, Ziming ; Dai, Zongbei ; Zhou, Jian...
Journal of Power Electronics.  24 (2023)  2 - p. 305-315 , 2023
 
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5

Failure Analysis of Open Circuit for the LEDs of Epoxy Resi..:

, In: 2023 6th International Conference on Electronics Technology (ICET),
Peng, Bo ; Xu, Huangxiang ; Dai, Zongbei... - p. 391-395 , 2023
 
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8

Vias electromigration lifetime reliability evaluation by us..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Wen, Zhang Xiao ; Ling, Lin Xiao ; Dai, Zongbei. - p. 833-836 , 2022
 
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9

The effect of cyclic thermal loading rate on the mechanical..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Bao, Hong ; Liu, Tianhan ; Ning, Minjie... - p. 114-118 , 2022
 
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10

Using data mining and root cause analysis method for failur..:

Wang, Hongjian ; Zhao, Zhenbo ; Dai, Zongbei..
IOP Conference Series: Materials Science and Engineering.  1043 (2021)  2 - p. 022024 , 2021
 
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13

Combined methods for analyzing the nonvisual failures of a ..:

, In: 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Ni, Yiqiang ; Dai, Zongbei ; Chen, Xuanlong... - p. 1-5 , 2020
 
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