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2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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Novel Submicron Spatial Resolution Infrared Microspectrosco..:
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2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) ,
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Failure Analysis for Qualification of Stiffener Attachment ..:
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2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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High-resolution 3D X-ray Microscopy for Structural Inspecti..:
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2019 7th International Conference on Mechatronics Engineering (ICOM) ,
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Motion Estimation on Homogenous Surface for Around View Mon..:
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Springer Proceedings in Materials; Intelligent Manufacturing and Mechatronics ,
7
Formulation of NSF H2 Food-Grade Grease from Vegetable-Base..:
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2023 IEEE Regional Symposium on Micro and Nanoelectronics (RSM) ,
8
Electrochemical EGFET pH Sensing Performance using ZnO-base..:
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2023 IEEE Regional Symposium on Micro and Nanoelectronics (RSM) ,
9
Fabrication of TiO2-PANI Nanostructure using Electrospray f..:
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2023 IEEE Regional Symposium on Micro and Nanoelectronics (RSM) ,
11
Surface Morphology of Fabricated TiO2-Graphene Thin Film by..:
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Recent Progress in Lead-Free Solder Technology; Topics in Mining, Metallurgy and Materials Engineering ,
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