Zuruzi, A. S.
13  Ergebnisse:
Personensuche X
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1

Influence of sintering environment on silver sintered on co..:

Siow, K. S. ; Chua, S. T. ; Beake, B. D..
Journal of Materials Science: Materials in Electronics.  30 (2019)  6 - p. 6212-6223 , 2019
 
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5

Facile Fabrication and Integration of Patterned Nanostructu..:

Zuruzi, A. S. ; MacDonald, N. C.
Advanced Functional Materials.  15 (2005)  3 - p. 396-402 , 2005
 
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6

Correlation between intermetallic thickness and roughness d..:

Zuruzi, A. S. ; Lahiri, S. K. ; Burman, P..
Journal of Electronic Materials.  30 (2001)  8 - p. 997-1000 , 2001
 
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7

Nickel silicide as a contact material for submicron CMOS de..:

Chi, D. Z. ; Mangelinck, D. ; Zuruzi, A. S...
Journal of Electronic Materials.  30 (2001)  12 - p. 1483-1488 , 2001
 
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8

Roughness evolution of Cu6Sn5 intermetallic during solderin:

Zuruzi, A. S. ; Chiu, C.-h. ; Lahiri, S. K..
Journal of Applied Physics.  86 (1999)  9 - p. 4916-4921 , 1999
 
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10

Kinetics of copper and high Pb/high Sn bilayered Pb-Sn sold..:

Zuruzi, A. S. ; Chiu, C. -H. ; Lahiri, S. K..
Journal of Electronic Materials.  28 (1999)  11 - p. 1224-1230 , 1999
 
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11

Effects of surface roughness on the diffusion bonding of Al..:

Zuruzi, A.S ; Li, H ; Dong, G
Materials Science and Engineering: A.  270 (1999)  2 - p. 244-248 , 1999
 
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12

Electrical conductivity of porous silver made from sintered..:

Zuruzi, Abu Samah ; Siow, Kim S.
Electronic Materials Letters.  11 (2015)  2 - p. 308-314 , 2015
 
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