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de Marneffe, J.-F.
52  Ergebnisse:
Personensuche X
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1

Characterization and Advanced Modeling of Dielectric Defect..:

Asanovski, R. ; Arimura, H. ; de Marneffe, J.-F....
IEEE Transactions on Electron Devices.  71 (2024)  3 - p. 1745-1751 , 2024
Link: https://doi.org/10.1109/..
 
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2

Enhancing dielectric passivation on monolayer WS2 via a sac..:

Wyndaele, P.-J. ; de Marneffe, J.-F. ; Sergeant, S....
npj 2D Materials and Applications.  8 (2024)  1 - p. , 2024
Link: https://doi.org/10.1038/..
 
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3

Novel Low Thermal Budget CMOS RMG: Performance and Reliabil..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Franco, J. ; Arimura, H. ; de Marneffe, J.-F.... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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4

Towards low damage and fab-compatible top-contacts in MX2 t..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Kundu, S. ; van Dorp, D. H. ; Schram, T.... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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5

Novel Low Thermal Budget CMOS RMG: Performance and Reliabil..:

Franco, J. ; Arimura, H. ; de Marneffe, J.-F....
IEEE Transactions on Electron Devices.  70 (2023)  12 - p. 6658-6664 , 2023
Link: https://doi.org/10.1109/..
 
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6

Low thermal budget PBTI and NBTI reliability solutions for ..:

, In: 2022 International Electron Devices Meeting (IEDM),
Franco, J. ; Arimura, H. ; De Marneffe, J.-F.... - p. 30.4.1-30.4.4 , 2022
Link: https://doi.org/10.1109/..
 
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7

Low-temperature atomic and molecular hydrogen anneals for e..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Franco, J. ; Arimura, H. ; de Marneffe, J.-F.... - p. 31.4.1-31.4.4 , 2021
Link: https://doi.org/10.1109/..
 
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8

Area selective grafting of siloxane molecules on low-k diel..:

Rezvanov, A. ; Gornev, E.S. ; de Marneffe, J.-F..
Applied Surface Science.  476 (2019)  - p. 317-324 , 2019
Link: https://doi.org/10.1016/..
 
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9

Metal barrier induced damage in self-assembly based organos..:

Krishtab, M. ; de Marneffe, J.-F. ; Armini, S....
Applied Surface Science.  485 (2019)  - p. 170-178 , 2019
Link: https://doi.org/10.1016/..
 
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10

Damage-free plasma etching of porous organo-silicate low-k ..:

Chanson, R. ; Zhang, L. ; Naumov, S....
Scientific Reports.  8 (2018)  1 - p. , 2018
Link: https://doi.org/10.1038/..
 
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11

Gas Phase Pore Stuffing for the protection of organo-silica..:

, In: 2018 International Symposium on Semiconductor Manufacturing (ISSM),
Fujikawa, M. ; Sato, N. ; de Marneffe, J. -F.... - p. 1-3 , 2018
Link: https://doi.org/10.1109/..
 
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12

Plasma induced damage mitigation in spin-on self-assembly b..:

Krishtab, M. ; de Marneffe, J.-F. ; De Gendt, S..
Applied Physics Letters.  110 (2017)  1 - p. , 2017
Link: https://doi.org/10.1063/..
 
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13

Multilayer MoS2 growth by metal and metal oxide sulfurizati..:

Heyne, M. H. ; Chiappe, D. ; Meersschaut, J....
Journal of Materials Chemistry C.  4 (2016)  6 - p. 1295-1304 , 2016
Link: https://doi.org/10.1039/..
 
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14

Influence of porosity on electrical properties of low-k die..:

Choudhury, F. A. ; Nguyen, H. M. ; Baklanov, M. R....
Applied Physics Letters.  109 (2016)  12 - p. , 2016
Link: https://doi.org/10.1063/..
 
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15

Defect-induced bandgap narrowing in low-k dielectrics:

Guo, X. ; Zheng, H. ; King, S. W....
Applied Physics Letters.  107 (2015)  8 - p. , 2015
Link: https://doi.org/10.1063/..
 
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